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Printed electronic devices for sustainable electronics

Grant number: 22/12332-7
Support Opportunities:Regular Research Grants
Duration: February 01, 2023 - January 31, 2025
Field of knowledge:Engineering - Materials and Metallurgical Engineering
Principal Investigator:Neri Alves
Grantee:Neri Alves
Host Institution: Faculdade de Ciências e Tecnologia (FCT). Universidade Estadual Paulista (UNESP). Campus de Presidente Prudente. Presidente Prudente , SP, Brazil

Abstract

The silicon electronics have shaped the modern society inseparable from everyone daily life. However, this technology is not compatible with the demand for the implementation of a low-cost electronics that produce lightweight, flexible, transparent and large-area devices. In this context, printed electronics emerges as an alternative that aims to meet the aforementioned demands and that allows integration with smart packaging, adornment pieces and accessories. The advancement of the printed electronics state of the art must be combined with an environmental impact assessment. The Global E-waste Monitor statistics suggest that the accumulation of e-waste is alarming, which is estimated to reach 74 million tons in 2030. Therefore, conciliating printed electronics with sustainability is a very modern subject to not repeat the same environmental impact statistics of the more conventional technology. This project proposes the fabrication of electronic devices, such as diodes, transistors, electrolyte-gated transistors and supercapacitors, in a fully biodegradable and printed way, that is, after their function be accomplished, it degrades without causing environmental damage. This requires substrates that support the device's structure, as well as conductor and semiconductor inks that are all biodegradable. In this context, we will use zinc oxide as the main semiconductor, molybdenum, PEDOT:PSS, and carbon-based materials as electrodes, and as insulator we will use organic dielectric and electrolytes such as ultrapure water, cellulose-based ionic gel, and honey. This project aims to characterize devices, interfaces and deposition conditions that allow obtaining the best performances for possible commercial applications. (AU)

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