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Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys

Grant number: 15/18689-0
Support type:Scholarships abroad - Research Internship - Doctorate
Effective date (Start): February 01, 2016
Effective date (End): April 30, 2016
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
Principal Investigator:José Eduardo Spinelli
Grantee:Bismarck Luiz Silva
Supervisor abroad: Nathalie Mangelinck-Noel
Home Institution: Centro de Ciências Exatas e de Tecnologia (CCET). Universidade Federal de São Carlos (UFSCAR). São Carlos , SP, Brazil
Local de pesquisa : Institut Matériaux Microélectronique Nanosciences de Provence (Im2np), France  
Associated to the scholarship:13/08259-3 - Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys, BP.DR

Abstract

Sn-Bi solder alloys seem to be promising for replacing traditional Pb-based alloys. Low melting point and low relative costs characterize such alternative alloys, which are quite important factors to be considered for applications in microelectronics. However, unsuitable mechanical properties and low wettability are some drawbacks faced by such alloys. Microadditions containing Ag and Cu may improve these properties according to literature. The present work aims to evaluate the effects of adding Cu and Ag on the Sn-Bi based alloys during transient directional solidification. The results will include: mechanical properties, macrostructure, microstructure, thermal parameters during solidification, macrosegregation, X-ray diffraction. The expected large range of cooling rates will allow a complete evaluation of interrelations among microstructure and mentioned parameters to be performed.