Design and Semisolid Processing of High-Entropy Alloys Based on the CrCuFeMnNi System

• Grant number: 18/10190-5
• Support Opportunities: Scholarships in Brazil - Post-Doctoral
• Start date: September 01, 2018
• End date: January 15, 2020
• Field of knowledge: Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
• Principal Investigator: Rubens Caram Junior
• Grantee: Kaio Niitsu Campo
• Host Institution: Faculdade de Engenharia Mecânica (FEM). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
• Associated scholarship(s): 19/11374-5 - Exploiting near-eutectic high entropy alloys for semisolid metal processing, BE.EP.PD

Abstract

Semisolid processing of alloys comprises a whole class of technological processes that exploits the thixotropic behavior exhibited by metals with globular microstructure. Thixoforming is one of them and involves partial melting of a raw material before the forming step. It offers many advantages over conventional manufacturing processes, such as less turbulence during mold filling, reduced porosity, lower contraction during solidification, lower working temperatures, lower forming loads and the possibility of producing complex-shaped components. Despite these significant advantages, thixoforming is still limited in industry due to the lack of alloys amenable to the process, which explains the effort for the development of brand new compositions or even the modification of existing ones. In this context, high-entropy alloys have become a new source of exploitation. Such alloys consist of solid solutions composed of multiple principal alloying elements. Based on this, an ideal high entropy alloy would be that presenting at least two solid solutions with discrepant melting points, leading to the formation of a solidification interval. Therefore, the objective of this project is to develop high-entropy alloys specifically designed for thixoforming. Such a goal will be achieved by selecting suitable Cu contents in CrCuxFeMnNi alloys and, thus, by studying the microstructural evolution and deformation behavior of these alloys in the semisolid state. Lastly, the mechanical properties of thixoformed samples will be determined.

Scientific publications

(6)

(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)

WISCHI, M.; CAMPO, K. N.; STARCK, L. F.; DA FONSECA, E. B.; LOPES, E. S. N.; CARAM, R.. Microstructure and mechanical behavior of the directionally solidified AlCoCrFeNi2.1 eutectic high-entropy alloy. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 20, p. 10-pg., 2022-08-11. (18/18293-8, 18/10190-5)

LIMA, DALTON DANIEL; CAMPO, KAIO NIITSU; BUTTON, SERGIO TONINI; CARAM, RUBENS. 3D thixo-printing: A novel approach for additive manufacturing of biodegradable Mg-Zn alloys. MATERIALS & DESIGN, v. 196, NOV 2020. (18/10190-5)

CAMPO, KAIO NIITSU; FREITAS, CAIO CHAUSSE DE; FONSECA, EDUARDO BERTONI DA; CARAM, RUBENS. CrCuFeMnNi high-entropy alloys for semisolid processing: The effect of copper on phase formation, melting behavior, and semisolid microstructure. MATERIALS CHARACTERIZATION, v. 178, AUG 2021. (18/10190-5)

CAMPO, KAIO NIITSU; DE FREITAS, CAIO CHAUSSE; FANTON, LEONARDO; CARAM, RUBENS. Melting behavior and globular microstructure formation in semi-solid CoCrCuxFeNi high-entropy alloys. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v. 52, p. 207-217, SEP 1 2020. (18/10190-5)

DE FREITAS, CAIO CHAUSSE; CARAM, RUBENS; CAMPO, KAIO NIITSU. Semisolid deformation behavior and processing of CoCrCuxFeNi high-entropy alloys. INTERMETALLICS, v. 150, p. 4-pg., 2022-08-13. (18/18293-8, 18/10190-5)

LIMA, DALTON DANIEL; CAMPO, KAIO NIITSU; BUTTON, SERGIO TONINI; CARAM, RUBENS. 3D thixo-printing: A novel approach for additive manufacturing of biodegradable Mg-Zn alloys. MATERIALS & DESIGN, v. 196, p. 9-pg., 2020-11-01. (18/10190-5)