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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy

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Author(s):
Silva, Bismarck Luiz [1] ; Garcia, Amauri [2] ; Spinelli, Jose Eduardo [1]
Total Authors: 3
Affiliation:
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil
Total Affiliations: 2
Document type: Journal article
Source: MICROELECTRONICS RELIABILITY; v. 54, n. 12, p. 2929-2934, DEC 2014.
Web of Science Citations: 5
Abstract

Sn-Ag-Cu alloys have emerged as the most promising lead-free solder series among a number of alternatives. These alloys generally present a dendritic Sn-rich matrix surrounded by a eutectic mixture (beta + alpha), where beta is the Sn-rich phase and alpha is the Ag3Sn intermetallic compound. The present study aims to investigate the effects of dendritic (lambda(2), lambda(3)) and eutectic (lambda) spacings and the morphology of Ag3Sn particles on hardness of the Sn-3.0 wt%Ag-0.7 wt%Cu alloy (SAC307). In order to establish correlations between lambda(2,3) and hardness, transient directional solidification (DS) experiments were performed permitting a wide range of different microstructures to be examined. The techniques used for microstructure characterization included dissolution of the Sn-rich matrix, optical/scanning electron microscopy. A dendritic microstructure prevailed in the entire DS casting. It is shown that the hardness tends to decrease with the increase in lambda(2), lambda(3) and lambda(F) (eutectic spacing for Ag3Sn having a fiber morphology). Experimental equations relating microstructural spacings to hardness are proposed. (C) 2014 Elsevier Ltd. All rights reserved. (AU)

FAPESP's process: 13/13030-5 - Microstructure, thermal parameters, segregation and mechanical properties of lead-free Sn-based, Zn-based and Bi-based solder alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 13/08259-3 - Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys
Grantee:Bismarck Luiz Silva
Support Opportunities: Scholarships in Brazil - Doctorate