110-GHz Through-Substrate-Via Transition Based on Copper Nanowires in Alumina Membrane

Author(s)

Pinheiro, Julio M. ^[1] ; Rehder, Gustavo P. ^[1] ; Gomes, Leonardo G. ^[1] ; Alvarenga, Rogerio C. A. ^[1] ; Pelegrini, Marcus V. ^[1] ; Podevin, Florence ^{[2, 3]} ; Ferrari, Philippe ^{[2, 3]} ; Serrano, Ariana L. C. ^[1]

Affiliation

^[1] Univ Sao Paulo, Lab Microelect, BR-05508900 Sao Paulo - Brazil

^[2] Univ Grenobles Alpes, IMEP LAHC, F-380010 Grenoble - France

^[3] CNRS, IMEP LAHC, F-38000 Grenoble - France

• Document type: Journal article
• Source: IEEE Transactions on Microwave Theory and Techniques; v. 66, n. 2, p. 784-790, FEB 2018.
• Web of Science Citations: 2

Abstract

A new through-substrate via (TSV) for millimeter-wave frequencies is proposed. The via is formed by copper nanowires connecting the bottom and top surfaces of a porous alumina membrane. It is shown here that the nanowire via is simple to fabricate using a low-cost technology. The nanowire vias were tested as coplanar waveguide transitions and characterized up to 110 GHz. The results show insertion loss better than 0.37 dB and return loss better than 14 dB per transition at 110 GHz. An electrical model for the vias was derived to give a design tool for circuit designers. These TSVs, along with the high-performance transmission lines already developed on the porous alumina membranes, contribute to a powerful platform for the design of high-performance circuits on this innovative interposer. (AU)

• FAPESP's process: 11/18167-3 - RF MEMS for millimetric waves using commercial CMOS process
• Grantee: Gustavo Pamplona Rehder
• Support Opportunities: Research Grants - Young Investigators Grants
• FAPESP's process: 12/15159-2 - High performance and lowcost MnM devices for millimeter-wave applications from 30 to 110 GHz
• Grantee: Ariana Maria da Conceicao Lacorte Caniato Serrano
• Support Opportunities: Research Grants - Young Investigators Grants