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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Chemical Stabilization and Improved Thermal Resilience of Molecular Arrangements: Possible Formation of a Surface Network of Bonds by Multiple Pulse Atomic Layer Deposition

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de Pauli, Muriel [1] ; Matos, Matheus J. S. [1] ; Siles, Pablo F. [2, 3] ; Prado, Mariana C. [1] ; Neves, Bernardo R. A. [1] ; Ferreira, Sukarno O. [4] ; Mazzoni, Mario S. C. [1] ; Malachias, Angelo [1]
Total Authors: 8
[1] Univ Fed Minas Gerais, Dept Fis, ICEx, BR-30123970 Belo Horizonte, MG - Brazil
[2] Tech Univ Chemnitz, Mat Syst Nanoelect, D-09107 Chemnitz - Germany
[3] IFW Dresden, Inst Integrat Nanosci, D-01069 Dresden - Germany
[4] Univ Fed Vicosa, Dept Fis, BR-36571000 Vicosa, MG - Brazil
Total Affiliations: 4
Document type: Journal article
Source: Journal of Physical Chemistry B; v. 118, n. 32, p. 9792-9799, AUG 14 2014.
Web of Science Citations: 1

In this work, we make use of an atomic layer deposition (ALD) surface reaction based on trimethyl-aluminum (TMA) and water to modify O-H terminated self-assembled layers of octadecylphosphonic acid (OPA). The structural modifications were investigated by X-ray reflectivity, X-ray diffraction, and atomic force microscopy. We observed a significant improvement in the thermal stability of ALD-modified molecules, with the existence of a supramolecular packing structure up to 500 degrees C. Following the experimental observations, density functional theory (DFT) calculations indicate the possibility of formation of a covalent network with aluminum atoms connecting OPA molecules at terrace surfaces. Chemical stability is also achieved on top of such a composite surface, inhibiting further ALD oxide deposition. On the other hand, in the terrace edges, where the covalent array is discontinued, the chemical conditions allow for oxide growth. Analysis of the DFT results on band structure and density of states of modified OPA molecules suggests that besides the observed thermal resilience, the dielectric character of OPA layers is preserved. This new ALD-modified OPA composite is potentially suitable for applications such as dielectric layers in organic devices, where better thermal performance is required. (AU)

FAPESP's process: 09/09027-3 - Study of growth, crystallization and surface structure of thin films, multilayers and nanostructures obtained by the atomic layer deposition method
Grantee:Angelo Malachias de Souza
Support type: Research Grants - Young Investigators Grants