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José Eduardo Spinelli

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Universidade Federal de São Carlos (UFSCAR). Centro de Ciências Exatas e de Tecnologia (CCET)  (Instituição-sede da última proposta de pesquisa)
País de origem: Brasil

Possui graduação em Engenharia Mecânica pela Unesp- Bauru (1998), mestrado em Engenharia Mecânica pela Unicamp (2000) e doutorado em Engenharia Mecânica pela Unicamp (2005). Atuou como pesquisador colaborador da Unicamp e realizou pos-doutorados no IM2NP (Institut Matériaux Microélectronique Nanosciences de Provence), em Marselha/França, na Ecole de Mines de Paris, em Sophia-Antipolis/França, e na University of Alberta, Edmonton/Canada. Atualmente é professor Associado do Departamento de Engenharia de Materiais (DEMa) da UFSCar. Tem experiência na área de Engenharia de Materiais e Processos de Fabricação, com ênfase na avaliação dos efeitos da solidificação nos processos de fabricação e na qualidade dos produtos. (Fonte: Currículo Lattes)

Auxílios à pesquisa
Bolsas no país
Bolsas no Exterior
Apoio FAPESP em números * Quantidades atualizadas em 15/02/2020
Colaboradores mais frequentes em auxílios e bolsas FAPESP
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Este canal da BV/FAPESP deve ser utilizado tão somente para mensagens, referentes aos projetos científicos financiados pela FAPESP.


 

 

 

 

Palavras-chave utilizadas pelo pesquisador
Publicações resultantes de Auxílios e Bolsas sob responsabilidade do(a) pesquisador(a) (60)

(Referências obtidas automaticamente do Web of Science e do SciELO, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores)

Publicações60
Citações485
Cit./Artigo8,1
Dados do Web of Science

OSORIO, WISLEI R.; FREITAS, EMMANUELLE S.; SPINELLI, JOSE E.; GARCIA, AMAURI. Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution. Corrosion Science, v. 80, p. 71-81, . Citações Web of Science: 20. (13/15478-3)

FREITAS, EMMANUELLE S.; SILVA, ADRINA P.; SPINELLI, JOSE E.; CASTELETTI, LUIZ C.; GARCIA, AMAURI. Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al-Bi and Al-Pb Alloys. TRIBOLOGY LETTERS, v. 55, n. 1, p. 111-120, . Citações Web of Science: 14. (13/15478-3, 13/13030-5)

BRITO, CRYSTOPHER; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. High cooling rate cells, dendrites, microstructural spacings and microhardness in a directionally solidified Al-Mg-Si alloy. Journal of Alloys and Compounds, v. 636, p. 145-149, . Citações Web of Science: 20. (12/08494-0, 14/25809-0, 13/23396-7)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 43, n. 5, p. 1347-1361, . Citações Web of Science: 16. (13/08259-3, 13/13030-5)

SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 8, n. 1, p. 1581-1586, . Citações Web of Science: 1. (17/12741-6)

SCHON, ALINE FERREIRA; REYES, RODRIGO VALENZUELA; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; SILVA, BISMARCK LUIZ. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal of Alloys and Compounds, v. 809, . Citações Web of Science: 0. (17/12741-6)

CANTE, V, MANUEL; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. An Alternative to the Recycling of Fe-Contaminated Al. JOURNAL OF SUSTAINABLE METALLURGY, v. 4, n. 3, p. 412-426, . Citações Web of Science: 1. (17/16058-9, 15/11863-5, 16/10596-6, 17/12741-6)

GOMES, LEONARDO F.; SPINELLI, J. E.; BOGNO, A-A; GALLERNEAULT, M.; HENEIN, H.. Influence of annealing treatment on Si morphology and strength of rapid solidified Al-12 wt% Si powders. Journal of Alloys and Compounds, v. 785, p. 1077-1085, . Citações Web of Science: 0. (18/15059-4, 17/12741-6)

LIMA, THIAGO SOARES; DE GOUVEIA, GUILHERME LISBOA; SEPTIMIO, RUDIMYLLA DA SILVA; DA CRUZ, CLARISSA BARROS; SILVA, BISMARCK LUIZ; BRITO, CRYSTOPHER; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. METALS, v. 9, n. 2, . Citações Web of Science: 1. (15/11863-5, 16/18186-1, 17/12741-6)

VIDA, TALITA A.; BRITO, CRYSTOPHER; LIMA, THIAGO S.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Near-eutectic Zn-Mg alloys: Interrelations of solidification thermal parameters, microstructure length scale and tensile/corrosion properties. CURRENT APPLIED PHYSICS, v. 19, n. 5, p. 582-598, . Citações Web of Science: 0. (17/16058-9, 14/50502-5)

SILVA, BISMARCK LUIZ; BERTELLI, FELIPE; CANTE, MANUEL V.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 27, n. 2, p. 1994-2003, . Citações Web of Science: 7. (13/08259-3, 13/13030-5)

DIAS, MARCELINO; COSTA, THIAGO; ROCHA, OTAVIO; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn-Sb lead-free solder alloys. MATERIALS CHARACTERIZATION, v. 106, p. 52-61, . Citações Web of Science: 12. (13/23396-7, 13/09267-0)

SILVA, BISMARCK LUIZ; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy. MATERIALS CHARACTERIZATION, v. 107, p. 43-53, . Citações Web of Science: 22. (13/08259-3, 13/13030-5)

SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; BERTELLI, FELIPE; SPINELLI, JOSE E.; GARCIA, AMAURI. Microstructural development of hypoeutectic Zn-(10-40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness. Journal of Alloys and Compounds, v. 647, p. 989-996, . Citações Web of Science: 13. (12/08494-0, 13/13030-5, 12/16328-2)

FREITAS, EMMANUELLE S.; OSORIO, WISLEI R.; SPINELLI, JOSE E.; GARCIA, AMAURI. Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy. MICROELECTRONICS RELIABILITY, v. 54, n. 6-7, p. 1392-1400, . Citações Web of Science: 22. (13/13030-5, 13/15478-3)

BOGNO, ABDOUL-AZIZ; SPINELLI, JOSE EDUARDO; MOREIRA AFONSO, CONRADO RAMOS; HENEIN, HANI. Microstructural and mechanical properties analysis of extruded Sn-0.7Cu solder alloy. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 4, n. 1, p. 84-92, . Citações Web of Science: 8. (13/50375-0)

SILVA, BISMARCK LUIZ; EVANGELISTA DA SILVA, VITOR COVRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, n. 3, p. 1754-1769, . Citações Web of Science: 9. (13/08259-3, 15/11863-5)

DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, . Citações Web of Science: 0. (13/09267-0, 17/15158-0, 16/18186-1)

DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, . Citações Web of Science: 1. (17/15158-0, 15/11863-5, 16/18186-1, 17/12741-6)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications. MATERIALS & DESIGN, v. 58, p. 482-490, . Citações Web of Science: 23. (13/13030-5)

FREITAS, EMMANUELLE S.; SILVA, ADRINA P.; SPINELLI, JOSE E.; CASTELETTI, LUIZ C.; GARCIA, AMAURI. Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al-Bi and Al-Pb Alloys. TRIBOLOGY LETTERS, v. 55, n. 1, p. 111-120, . Citações Web of Science: 14. (13/15478-3, 13/13030-5)

BRITO, CRYSTOPHER; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. High cooling rate cells, dendrites, microstructural spacings and microhardness in a directionally solidified Al-Mg-Si alloy. Journal of Alloys and Compounds, v. 636, p. 145-149, . Citações Web of Science: 20. (12/08494-0, 14/25809-0, 13/23396-7)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 43, n. 5, p. 1347-1361, . Citações Web of Science: 16. (13/08259-3, 13/13030-5)

SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys. Materials Letters, v. 142, p. 163-167, . Citações Web of Science: 20. (13/08259-3, 13/13030-5)

GOMES, LEONARDO F.; SPINELLI, J. E.; BOGNO, A-A; GALLERNEAULT, M.; HENEIN, H.. Influence of annealing treatment on Si morphology and strength of rapid solidified Al-12 wt% Si powders. Journal of Alloys and Compounds, v. 785, p. 1077-1085, . Citações Web of Science: 0. (18/15059-4, 17/12741-6)

LIMA, THIAGO SOARES; DE GOUVEIA, GUILHERME LISBOA; SEPTIMIO, RUDIMYLLA DA SILVA; DA CRUZ, CLARISSA BARROS; SILVA, BISMARCK LUIZ; BRITO, CRYSTOPHER; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. METALS, v. 9, n. 2, . Citações Web of Science: 1. (15/11863-5, 16/18186-1, 17/12741-6)

VIDA, TALITA A.; BRITO, CRYSTOPHER; LIMA, THIAGO S.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Near-eutectic Zn-Mg alloys: Interrelations of solidification thermal parameters, microstructure length scale and tensile/corrosion properties. CURRENT APPLIED PHYSICS, v. 19, n. 5, p. 582-598, . Citações Web of Science: 0. (17/16058-9, 14/50502-5)

KAKITANI, RAFAEL; REYES, RODRIGO V.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Effects of Melt Superheating on the Microstructure and Tensile Properties of a Ternary Al-15 Wt Pct Si-1.5 Wt Pct Mg Alloy. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 50A, n. 3, p. 1308-1322, . Citações Web of Science: 1. (17/12741-6)

REYES, RODRIGO V.; PINOTTI, VITOR E.; AFONSO, CONRADO R. M.; CASTELETTI, LUIZ C.; GARCIA, AMAURI; SPINELLI, JOSE E.. Processing, As-Cast Microstructure and Wear Characteristics of a Monotectic Al-Bi-Cu Alloy. Journal of Materials Engineering and Performance, v. 28, n. 2, SI, p. 1201-1212, . Citações Web of Science: 0. (17/12741-6)

SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal of Alloys and Compounds, v. 691, p. 600-605, . Citações Web of Science: 18. (13/08259-3, 15/11863-5)

DIAS, MARCELINO; COSTA, THIAGO A.; SILVA, BISMARCK L.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. MICROELECTRONICS RELIABILITY, v. 81, p. 150-158, . Citações Web of Science: 7. (13/09267-0, 17/15158-0, 16/18186-1)

SPINELLI, J. E.; BOGNO, A. -A.; HENEIN, H.. Two-Zone Microstructures in Al-18Si Alloy Powders. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 49A, n. 2, p. 550-562, . Citações Web of Science: 3. (15/11863-5, 16/10596-6)

CANTE, V, MANUEL; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. An Alternative to the Recycling of Fe-Contaminated Al. JOURNAL OF SUSTAINABLE METALLURGY, v. 4, n. 3, p. 412-426, . Citações Web of Science: 1. (17/16058-9, 15/11863-5, 16/10596-6, 17/12741-6)

REYES, RODRIGO V.; BELLO, THOMAS S.; KAKITANI, RAFAEL; COSTA, THIAGO A.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 685, p. 235-243, . Citações Web of Science: 21. (15/03116-5, 15/11863-5)

CURTULO, JOANISA P.; DIAS, MARCELINO; BERTELLI, FELIPE; SILVA, BISMARCK L.; SPINELLI, JOSE E.; GARCIA, AMAURI; CHEUNG, NOE. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates. JOURNAL OF MANUFACTURING PROCESSES, v. 48, p. 164-173, . Citações Web of Science: 0. (17/15158-0, 18/11791-2)

XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7, . Citações Web of Science: 0. (17/15158-0, 15/11863-5, 16/10596-6, 16/18186-1)

SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 8, n. 1, p. 1581-1586, . Citações Web of Science: 1. (17/12741-6)

SCHON, ALINE FERREIRA; REYES, RODRIGO VALENZUELA; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; SILVA, BISMARCK LUIZ. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal of Alloys and Compounds, v. 809, . Citações Web of Science: 0. (17/12741-6)

KAKITANI, RAFAEL; DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Thermal analysis during solidification of an Al-Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, v. 137, n. 3, p. 983-996, . Citações Web of Science: 1. (17/12741-6)

SCALET ROSSINI, LUIS FELIPE; VALENZUELA REYES, RODRIGO ANDRE; SPINELLI, JOSE EDUARDO. Double-wire tandem GMAW welding process of HSLA50 steel. JOURNAL OF MANUFACTURING PROCESSES, v. 45, p. 227-233, . Citações Web of Science: 0. (17/12741-6)

MORENO, GUSTAVO R.; SILVA, BISMARCK L.; BOGNO, ABDOUL-AZIZ; HENEIN, HANI; SPINELLI, JOSE E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, v. 680, p. 259-267, . Citações Web of Science: 5. (13/50375-0)

SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, . Citações Web of Science: 3. (13/08259-3, 15/11863-5)

BRITO, C.; BERTELLI, F.; CASTANHO, M. A. P.; GOULART, P. R.; CHEUNG, N.; SPINELLI, J. E.; GARCIA, A.. Upward and downward unsteady-state directional solidification of a hypoeutectic Al-3wt.% Mg alloy. CIENCIA & TECNOLOGIA DOS MATERIAIS, v. 29, n. 1, p. E65-E70, . Citações Web of Science: 1. (12/08494-0, 14/25809-0, 14/50502-5, 13/23396-7, 12/16328-2)

BOGNO, ABDOUL-AZIZ; SPINELLI, JOSE EDUARDO; MOREIRA AFONSO, CONRADO RAMOS; HENEIN, HANI. Microstructural and mechanical properties analysis of extruded Sn-0.7Cu solder alloy. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 4, n. 1, p. 84-92, . Citações Web of Science: 8. (13/50375-0)

SILVA, BISMARCK LUIZ; EVANGELISTA DA SILVA, VITOR COVRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, n. 3, p. 1754-1769, . Citações Web of Science: 9. (13/08259-3, 15/11863-5)

DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, . Citações Web of Science: 0. (13/09267-0, 17/15158-0, 16/18186-1)

DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, . Citações Web of Science: 1. (17/15158-0, 15/11863-5, 16/18186-1, 17/12741-6)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications. MATERIALS & DESIGN, v. 58, p. 482-490, . Citações Web of Science: 23. (13/13030-5)

DIAS, MARCELINO; COSTA, THIAGO; ROCHA, OTAVIO; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn-Sb lead-free solder alloys. MATERIALS CHARACTERIZATION, v. 106, p. 52-61, . Citações Web of Science: 12. (13/23396-7, 13/09267-0)

SILVA, BISMARCK LUIZ; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy. MATERIALS CHARACTERIZATION, v. 107, p. 43-53, . Citações Web of Science: 22. (13/08259-3, 13/13030-5)

SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 25, n. 1, p. 478-486, . Citações Web of Science: 11. (10/17057-7)

BRITO, CRYSTOPHER; COSTA, THIAGO A.; VIDA, TALITA A.; BERTELLI, FELIPE; CHEUNG, NOE; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 46A, n. 8, p. 3342-3355, . Citações Web of Science: 20. (12/08494-0, 13/23396-7, 12/16328-2)

SILVA, BISMARCK LUIZ; DESSI, JOAO GUILHERME; GOMES, LEONARDO FERNANDES; PERES, MAURICIO MIRDHAUI; CANTE, MANUEL VENCESLAU; SPINELLI, JOSE EDUARDO. Assessing microstructures and mechanical resistances of as-atomized and as-extruded samples of Al-1wt%Fe-1wt%Ni alloy. Journal of Alloys and Compounds, v. 691, p. 952-960, . Citações Web of Science: 2. (13/08259-3, 15/11863-5)

BRITO, CRYSTOPHER; VIDA, TALITA; FREITAS, EMMANUELLE; CHEUNG, NOE; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Cellular/dendritic arrays and intermetallic phases affecting corrosion and mechanical resistances of an Al-Mg-Si alloy. Journal of Alloys and Compounds, v. 673, p. 220-230, . Citações Web of Science: 24. (14/50502-5, 12/08494-0, 14/25809-0, 13/15478-3, 13/23396-7)

SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient. Journal of Alloys and Compounds, v. 632, p. 274-285, . Citações Web of Science: 19. (13/08259-3, 13/13030-5)

SILVA, BISMARCK LUIZ; SPINELLI, JOSE EDUARDO; CANTE, MANUEL V.; BERTELLI, FELIPE; CHEUNG, NOE; RIVA, RUDIMAR; GARCIA, AMAURI. Experimental and numerical analyses of laser remelted Sn-0.7 wt% Cu solder surfaces. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 26, n. 5, p. 3100-3107, . Citações Web of Science: 0. (13/13030-5, 12/16328-2)

COSTA, T. A.; MOREIRA, A. L.; MOUTINHO, D. J.; DIAS, M.; FERREIRA, I. L.; SPINELLI, J. E.; ROCHA, O. L.; GARCIA, A.. Growth direction and Si alloying affecting directionally solidified structures of Al-Cu-Si alloys. MATERIALS SCIENCE AND TECHNOLOGY, v. 31, n. 9, p. 1103-1112, . Citações Web of Science: 23. (13/23396-7, 13/09267-0)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, . Citações Web of Science: 7. (13/08259-3, 13/13030-5)

SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; QUARESMA, JOSE M. V.; SPINELLI, JOSE E.; GARCIA, AMAURI. Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy. MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, v. 182, p. 29-36, . Citações Web of Science: 16. (12/08494-0)

SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. MATERIALS CHARACTERIZATION, v. 114, p. 30-42, . Citações Web of Science: 14. (13/08259-3, 13/13030-5)

Publicações acadêmicas

(Referências obtidas automaticamente das Instituições de Ensino e Pesquisa do Estado de São Paulo)

SPINELLI, José Eduardo. Influência da convecção no líquido nas variáveis térmicas e estruturais na solidificação descendente de ligas Sn-Pb. 2005. 169f. Tese (Doutorado) – Faculdade de Engenharia Mecânica. Universidade Estadual de Campinas (UNICAMP). Campinas.

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