Busca avançada
Ano de início
Entree
(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Electrical Conduction Mechanisms in Metal-Insulator-Metal (MIM) Structure with TiOxNy Thin Films Deposited with Different O/N Ratios

Texto completo
Autor(es):
Libardi, Juliano [1] ; Grigorov, Korneli G. [1, 2] ; Moraes, Rodrigo S. [1] ; Guerino, Marciel [1] ; Da Silva Sobrinho, Argemiro S. [1] ; Massi, Marcos [1, 3]
Número total de Autores: 6
Afiliação do(s) autor(es):
[1] Technol Inst Aeronaut ITA, Dept Phys, Sao Jose Dos Campos, SP - Brazil
[2] Space Res & Technol Inst, Sofia 1113 - Bulgaria
[3] Fed Univ Sao Paulo ICT, Sao Jose Dos Campos, SP - Brazil
Número total de Afiliações: 3
Tipo de documento: Artigo Científico
Fonte: Journal of Electronic Materials; v. 44, n. 1, p. 103-109, JAN 2015.
Citações Web of Science: 4
Resumo

In this work, the current-voltage characteristics of titanium oxynitride thin films were measured and the charge carrier transport mechanisms established as a function of film composition. The films were deposited by magnetron sputtering, where the oxygen/nitrogen ratio was varied via a pulsing technique to enable the achievement of desired concentrations. Thus, the obtained films showed metallic titanium nitrate (TiN) or semiconductor titanium dioxide (TiO2) character and were used to fabricate metal-insulator-metal structures. An ohmic conduction mechanism was identified in the films with higher nitrogen incorporation or presenting TiN-rich phase. Decrease in the nitrogen content resulted in films with TiO2-rich phase. In this case, Poole-Frenkel and space-charge-limited current conduction mechanisms were observed. The dielectric constants were calculated from the high-frequency capacitance-voltage dependences, with a reduction from 10 to 3 being observed due to the stoichiometric changes and probable incorporation of defects into the film structure. Finally, the film composition and structural characteristics of the films were revealed by Rutherford backscattering and x-ray diffraction techniques, respectively. (AU)

Processo FAPESP: 10/11294-7 - Deposição de Filmes Finos de TiO2 usando tecnologia de plasmas para aplicações em microeletrônica
Beneficiário:Juliano Libardi
Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado