| Texto completo | |
| Autor(es): |
Lima, Thiago Soares
[1]
;
de Gouveia, Guilherme Lisboa
[2]
;
Septimio, Rudimylla da Silva
[1]
;
da Cruz, Clarissa Barros
[1]
;
Silva, Bismarck Luiz
[3]
;
Brito, Crystopher
[4]
;
Spinelli, Jose Eduardo
[2]
;
Cheung, Noe
[1]
Número total de Autores: 8
|
| Afiliação do(s) autor(es): | [1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[2] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[3] Fed Univ Rio Grande do Norte UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil
[4] Sao Paulo State Univ, UNESP, Campus Sao Joao da Boa Vista, Sao Joao da Boa Vista - Brazil
Número total de Afiliações: 4
|
| Tipo de documento: | Artigo Científico |
| Fonte: | METALS; v. 9, n. 2 FEB 2019. |
| Citações Web of Science: | 1 |
| Resumo | |
In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, lambda(1), and secondary, lambda(2), dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller lambda(2) in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys. (AU) | |
| Processo FAPESP: | 17/12741-6 - Aplicação de técnicas experimentais de solidificação, caracterização microestrutural e de propriedades na avaliação de ligas eutéticas e hipereutéticas à base de Al e Zn |
| Beneficiário: | José Eduardo Spinelli |
| Modalidade de apoio: | Auxílio à Pesquisa - Regular |
| Processo FAPESP: | 15/11863-5 - Parâmetros da microestrutura de solidificação de ligas multicomponentes Al-Si-Cu, Sn-Bi-Sb e Zn-Sn-Cu e propriedades mecânicas decorrentes |
| Beneficiário: | José Eduardo Spinelli |
| Modalidade de apoio: | Auxílio à Pesquisa - Regular |
| Processo FAPESP: | 16/18186-1 - Evolução microestrutural e resistências mecânica e ao desgaste de ligas ternárias Al-Bi-Si e Al-Bi-Ni solidificadas unidirecionalmente |
| Beneficiário: | José Marcelino da Silva Dias Filho |
| Modalidade de apoio: | Bolsas no Brasil - Pós-Doutorado |