Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound

Autor(es)

Dias, Marcelino ^[1] ; Verissimo, Nathalia C. ^[1] ; Regone, Natal N. ^[2] ; Freitas, Emmanuelle S. ^[3] ; Cheung, Noe ^[1] ; Garcia, Amauri ^[1]

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, Dept Mfg & Mat Engn, Campinas, SP - Brazil

^[2] Sao Paulo State Univ, Campus Sao Joao da Boa Vista, Sao Joao Da Boa Vista - Brazil

^[3] Univ Fed Sao Paulo, Marine Inst, Santos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: CORROSION ENGINEERING SCIENCE AND TECHNOLOGY; v. 56, n. 1, p. 11-21, JAN 2 2021.
• Citações Web of Science: 0

Resumo

Sn-Sb solder alloys (2; 5.5 and 10wt-% Sb) were directionally solidified with a view to permitting the effect of a wide range of solidification cooling rates to be related to the resulting microstructure, which is shown to be formed by a cellular Sn-rich matrix with Sn-Sb intermetallic particles (IMCs) randomly distributed in the matrix The corrosion resistance of these alloys is investigated by electrochemical impedance spectroscopy (EIS), equivalent circuit and linear polarisation and the results correlated with microstructural features. The increase in the alloy Sb content is shown to change the nature/morphology of the Sn-Sb IMCs, consequently affecting the corrosion resistance. The EIS data indicated that the Sn-10wt-%Sb alloy has the best corrosion resistance because of the high resistance of its oxide barrier layer. The polarisation curves also indicate lowest corrosion rate and nobler potential related to the Sn-10wt-%Sb alloy, which has also been confirmed by calculations of polarisation resistance. (AU)

• Processo FAPESP: 18/11791-2 - Evolução Microestrutural e Resistências Mecânica e ao Desgaste de Ligas Ternárias Al-Bi-Si e Al-Bi-Ni Solidificadas Unidirecionalmente
• Beneficiário: José Marcelino da Silva Dias Filho
• Modalidade de apoio: Bolsas no Exterior - Estágio de Pesquisa - Pós-Doutorado
• Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular