Microstructural and segregation effects affecting the corrosion behavior of a high-temperature Bi-Ag solder alloy in dilute chloride solution

Autor(es)

Septimio, Rudimylla ^[1] ; Cruz, Clarissa ^[2] ; Silva, Bismarck ^[3] ; Garcia, Amauri ^[4] ; Spinelli, Jose Eduardo ^[5] ; Cheung, Noe ^[4]

Afiliação do(s) autor(es)

^[1] Fed Univ South & Southeast Para Unifesspa, Inst Geosci & Engn, BR-68500080 Maraba, Para - Brazil

^[2] Fed Univ Ouro Preto UFOP, Inst Exact & Appl Sci, Dept Prod Engn, BR-35931008 Joao Monlevade, MG - Brazil

^[3] Fed Univ Rio Grande do Norte UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil

^[4] Univ Estadual Campinas, Dept Mfg & Mat Engn, UNICAMP, BR-13083860 Campinas, SP - Brazil

^[5] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Applied Electrochemistry; v. 51, n. 5, p. 769-780, MAY 2021.
• Citações Web of Science: 0

Resumo

In electronic devices the solder joint is exposed not only to the air but also to moistures and other corrosive media such as chlorine and sulfur compounds. Bi-Ag alloys meet the melting temperature requirement to be classified as high-temperature solders, therefore, knowledge of corrosion behavior is important for a long-term reliability of Bi-Ag solder connections. However, corrosion studies of Bi-Ag alloys are quite restricted in the literature. In this study, the role of the representative length scale of the microstructure as well as of the effects of Ag segregation on the resulting corrosion behavior of Bi-4 wt% Ag alloy samples are investigated. Cyclic potentiodynamic polarization and electrochemical impedance spectroscopy measurements were performed, and an equivalent circuit was also proposed to simulate the electrochemical corrosion behavior. All the used techniques indicated a tendency of better corrosion resistance associated with the sample having coarser microstructure and less Ag content. {[}GRAPHICS] . (AU)

• Processo FAPESP: 17/12741-6 - Aplicação de técnicas experimentais de solidificação, caracterização microestrutural e de propriedades na avaliação de ligas eutéticas e hipereutéticas à base de Al e Zn
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 19/23673-7 - Avaliação de ligas para juntas térmicas e para manufatura aditiva
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular