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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy

Texto completo
Autor(es):
Santos, Washington L. R. [1] ; Brito, Crystopher [1] ; Quaresma, Jose M. V. [2] ; Spinelli, Jose E. [3] ; Garcia, Amauri [1]
Número total de Autores: 5
Afiliação do(s) autor(es):
[1] Univ Estadual Campinas, UNICAMP, Dept Mat Engn, BR-13083970 Campinas, SP - Brazil
[2] Fed Univ Para, UFPA, BR-66075110 Belem, Para - Brazil
[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Paulo - Brazil
Número total de Afiliações: 3
Tipo de documento: Artigo Científico
Fonte: MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS; v. 182, p. 29-36, MAR 2014.
Citações Web of Science: 16
Resumo

Although Zn-Sn alloys have suitable features for high temperature solders, as for example the absence of intermetallic compounds (IMCs) and relatively high melting temperatures, the control of the scale of the microstructure by adequate pre-programming of the solidification thermal parameters remains still a task to be accomplished. The present study focuses on the interrelation among hardness, microstructure features/segregation and solidification thermal parameters. An upward directional transient solidification apparatus was used in order to permit samples along a range of cooling rates to be obtained for such evaluation. The entire Zn-20wt%Sn alloy casting is characterized by a two-phase alternated structure, which resembles the morphology of a lamellar eutectic. Experimental growth laws having -1/2 and -1/4 exponents are proposed relating the interphase spacing to the growth rate and the cooling rate, respectively. The morphology and size of the Zn-rich plate-like cells, as well as the macrosegregation pattern are shown to affect the hardness. (C) 2013 Elsevier B.V. All rights reserved. (AU)

Processo FAPESP: 12/08494-0 - Parâmetros Térmicos e Microestruturais na Solidificação Transitória de Ligas Al-Mg e Al-Mg-Si e Correlação com Resistências Mecânica e à Corrosão
Beneficiário:Crystopher Cardoso de Brito
Linha de fomento: Bolsas no Brasil - Doutorado