Cellular-to-Dendritic and Dendritic-to-Cellular Morphological Transitions in a Ternary Al-Mg-Si Alloy

Autor(es)

Brito, C. ; Nguyen-Thi, H. ; Mangelinck-Noel, N. ; Cheung, N. ; Spinelli, J. E. ; Garcia, A. ; IOP

• Tipo de documento: Artigo Científico
• Fonte: 9TH WORLD CONGRESS ON COMPUTATIONAL MECHANICS AND 4TH ASIAN PACIFIC CONGRESS ON COMPUTATIONAL MECHANICS; v. 529, p. 6-pg., 2019-01-01.

Resumo

The study is focused on the influence of solidification thermal parameters upon the evolution of the microstructure (either cells or dendrites) of an Al-3wt%Mg-1wt%Si ternary alloy. It is well known that the application properties of metallic alloys will greatly depend on the final morphology of the microstructure. As a consequence, various studies have been carried out in order to determine the ranges of cooling rates associated with dendritic-cellular transitions in multicomponent alloys. In the present research work, directional solidification experiments were conducted using either a Bridgman (steady-state) device or another device that allows the solidification under transient conditions (unsteady-state). Thus, a broad range of cooling rates ((T) over dot), varying from 0.003K/s to 40K/s could be achieved. This led to the identification of a complete series of cellular/dendritic/cellular transitions. For low cooling rate experiments, low cooling rate cells to dendrites transition happens. Moreover, at a high cooling rate, a novel transition from dendrites to high cooling rate cells could be observed for the Al-3wt%Mg-1wt%Si alloy. Additionally, cell spacing lambda(C) and primary dendritic spacing lambda(1) are related to the cooling rate by power function growth laws characterized by the same exponent (-0.55) for both steady-state and unsteady-state solidification conditions. (AU)

• Processo FAPESP: 12/16328-2 - Correlação entre Microestruturas de Solidificação e Propriedades Mecânicas e Tribológicas de Ligas Al-Sn-Cu e Al-Sn-Si
• Beneficiário: Felipe Bertelli
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado
• Processo FAPESP: 14/25809-0 - Parâmetros térmicos e microestruturais na solidificação transitória de ligas Al-Mg e Al-Mg-Si e correlação com resistências mecânica e à corrosão
• Beneficiário: Crystopher Cardoso de Brito
• Modalidade de apoio: Bolsas no Exterior - Estágio de Pesquisa - Doutorado
• Processo FAPESP: 13/23396-7 - Efeitos de parâmetros da microestrutura de solidificação de ligas multicomponentes à base de alumínio (Al-Mg-Si; Al-Sn-Cu; Al-Zn-Mg) nas resistências à degradação por corrosão e tribocorrosão
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 12/08494-0 - Parâmetros Térmicos e Microestruturais na Solidificação Transitória de Ligas Al-Mg e Al-Mg-Si e Correlação com Resistências Mecânica e à Corrosão
• Beneficiário: Crystopher Cardoso de Brito
• Modalidade de apoio: Bolsas no Brasil - Doutorado