Femtosecond laser processing of amorphous silicon films

Autor(es)

Paula, K. T. ; Lin, H. -I. ; Yang, F. ; Vollet-Filho, J. D. ; Gu, T. ; Hu, J. ; Mendonca, C. R.

• Tipo de documento: Artigo Científico
• Fonte: JOURNAL OF MANUFACTURING PROCESSES; v. 128, p. 10-pg., 2024-08-21.

Resumo

Femtosecond laser micromachining is a pivotal approach within the dynamic field of laser surface structuring, offering unparalleled precision for materials processing. By exploiting the unique nonlinear light-matter interactions, this technique allows the creation of functional micro- and nanostructures with exceptional accuracy and reproducibility. Of particular interest is its ability to process diverse materials, including glasses, polymers, metals, and semiconductors, with minimal thermal impact and collateral damage. Moreover, femtosecond laser micromachining eliminates the need for traditional lithographic methods, enabling intricate structure fabrication under ambient conditions, thereby revolutionizing microfabrication techniques. This study demonstrates the micromachining using femtosecond lasers at 800 nm wavelength and explores the critical role of process parameters, such as laser pulse energy and the number of pulses in determining the damage threshold fluence, especially considering incubation effects in multi-pulse scenarios. Furthermore, it explores the potential of femtosecond laser micromachining for controlled crystallization in hydrogenated amorphous silicon (a-Si:H), unleashing enhanced electrical and optical properties. With its versatility, precision, and potential for diverse applications, femtosecond laser micromachining holds promise for driving advancements in electronic and photonic devices, particularly in high-efficiency photovoltaics, integrated photonics, and novel optoelectronic technologies. (AU)

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