Chemical inspection and elemental analysis of electronic waste using data fusion - Application of complementary spectroanalytical techniques

Autor(es)

Andrade, Daniel Fernandes ^{[1, 2]} ; de Almeida, Eduardo ^[3] ; Pereira de Carvalho, Hudson Wallace ^[3] ; Pereira-Filho, Edenir Rodrigues ^[2] ; Amarasiriwardena, Dulasiri ^[1]

Afiliação do(s) autor(es)

^[1] Hampshire Coll, Sch Nat Sci, Amherst, MA 01002 - USA

^[2] Univ Fed Sao Carlos, Dept Chem, Grp Appl Instrumental Anal, Rod Washington Luiz Km 235, BR-13565905 Sao Carlos, SP - Brazil

^[3] Univ Sao Paulo, Ctr Nucl Energy Agr, Lab Nucl Instrumentat, Av Centenario 303, BR-13416000 Piracicaba, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Talanta; v. 225, APR 1 2021.
• Citações Web of Science: 0

Resumo

This study is focused on the development of analytical methods for characterization of printed circuit boards (PCBs) from mobile phones by direct analysis using three complementary spectroanalytical techniques: laser ablation-inductively coupled plasma-mass spectrometry (LA-ICP-MS), laser-induced breakdown spectroscopy (LIBS), and micro X-ray fluorescence spectroscopy (micro-XRF). These techniques were combined with principal component analysis (PCA) to investigate the chemical composition on the surface and depth profiling of PCB samples. The spatial distribution of important base metals (e.g. Al, Au, Ba, Cu, Fe, Mg, Ni, Zn), toxic elements (e.g. Cd, Cr, Pb) as well as the non-metallic fraction (e.g. P, S and Si) from conductive tracks, solder mask and integrated components were detected within the PCB samples. Univariate and multivariate approaches were also performed to obtain calibration models for Cu determination. The results were compared to reference concentrations obtained by inductively coupled plasma-optical emission spectrometry (ICP-OES) after microwave-assisted acid leaching using aqua regia. To this end, two PCB samples (50 x 34 mm(2)) were cut into small parts of 40 subsamples (10 x 8.5 mm(2)) and analyzed by ICP-OES and the Cu concentrations ranged from 13 to 45% m m(-1). Partial least squares (PLS) regression was used to data fusion of analytical information from LIBS and micro-XRF analysis. The proposed calibration methods for LIBS and micro-XRF were tested for the 40 PCB subsamples, in which the best results were obtained combining both data sources though a low-level data fusion. Root mean square error of cross validation (RMSEC) and recoveries were 3.23% m m(-1) and 81-119% using leave-one-out cross validation. (AU)

• Processo FAPESP: 16/01513-0 - Combinação de LIBS (Laser-Induced Breakdown Spectroscopy) e ICP OES (Inductively Coupled Plasma Optical Emission Spectrometry) na análise de amostras de resíduo eletrônico (circuito eletrônico e polímeros), alimentos e líquidas de difícil preparação
• Beneficiário: Edenir Rodrigues Pereira Filho
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 15/05942-0 - Investigação do metabolismo de nanomateriais absorvidos por plantas empregando-se espectroscopias vibracional e de Raios X
• Beneficiário: Hudson Wallace Pereira de Carvalho
• Modalidade de apoio: Auxílio à Pesquisa - Jovens Pesquisadores
• Processo FAPESP: 16/17304-0 - Proposição de métodos para a análise direta de amostras de lixo eletrônico: determinação de elementos preciosos, estratégicos e tóxicos em circuitos eletrônicos e telas touch screen
• Beneficiário: Daniel Fernandes de Andrade
• Modalidade de apoio: Bolsas no Brasil - Doutorado
• Processo FAPESP: 18/24569-6 - Caracterização direta de telefones celulares utilizando fusão de dados provenientes de três técnicas espectroanalíticas complementares
• Beneficiário: Daniel Fernandes de Andrade
• Modalidade de apoio: Bolsas no Exterior - Estágio de Pesquisa - Doutorado
• Processo FAPESP: 19/24223-5 - Calibração empregando Laser-Induced Breakdown Spectroscopy (LIBS): alternativas, desafios, comparação das propostas existentes e proposição de um procedimento universal
• Beneficiário: Edenir Rodrigues Pereira Filho
• Modalidade de apoio: Auxílio à Pesquisa - Regular