| Texto completo | |
| Autor(es): |
Septimio, Rudimylla S.
;
Arenas, Maria A.
;
Conde, Ana
;
Garcia, Amauri
;
Cheung, Noe
;
de Damborenea, Juan
Número total de Autores: 6
|
| Tipo de documento: | Artigo Científico |
| Fonte: | CORROSION ENGINEERING SCIENCE AND TECHNOLOGY; v. 55, n. 8, p. 10-pg., 2020-07-07. |
| Resumo | |
Corrosion has become a frequent and significant issue in the electronics industry. For this reason, galvanic corrosion of soldered joints, i.e. when solder alloys are in contact with a metallic substrate, is so important. The present study aims to investigate the corrosion behaviour of the Bi-2.7wt-%Zn solder alloy when in contact with Cu and Ni substrates in a 0.06M NaCl solution. Polarisation curves show that Ni and Cu have nobler behaviour than the Bi-Zn alloy. However, although the Bi-Zn alloy exhibits active corrosion behaviour, the open circuit potential tends to shift toward more positive potentials over time. The galvanic current densities (i(galv)) of both Bi-Zn alloy/Ni and Cu couples are initially similar and three times higher than the corrosion current density of the Bi-Zn alloy. However, the couples show a decrease ini(galv.), with time and the couple formed with Ni has produced the lowest galvanic current density. (AU) | |
| Processo FAPESP: | 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial |
| Beneficiário: | Amauri Garcia |
| Modalidade de apoio: | Auxílio à Pesquisa - Regular |
| Processo FAPESP: | 17/16058-9 - Microestruturas de Solidificação e Resistência ao Desgaste de Ligas Monotéticas Zn-Al-Bi |
| Beneficiário: | Noe Cheung |
| Modalidade de apoio: | Bolsas no Exterior - Pesquisa |