The Influence of Residual Stresses Induced by Grinding on the Fracture Toughness of Cemented Tungsten Carbide

Autor(es)

Cruz, D. C. ; Christoforo, A. L. ; Sordi, V. L. ; Ventura, C. E. H.

• Tipo de documento: Artigo Científico
• Fonte: Journal of Materials Engineering and Performance; v. N/A, p. 10-pg., 2024-05-22.

Resumo

Grinding of cemented tungsten carbide blanks for cutting tools is responsible for the inducement of residual stress, which affects crack formation and propagation, influencing their lifetime. However, the direct measurement of residual stress is cost intensive and an alternative is proposed in this work, in which a mathematical relation (logistic function) between x-ray diffraction measurements and fracture toughness obtained by hardness measurements is generated for cemented tungsten carbide ground with different conditions. By means of statistical methods, a strong correlation (Pearson correlation coefficient higher than 0.85) between both variables was demonstrated. Moreover, it was found that higher values of fracture toughness as well as of compressive residual stresses can be obtained with the application of higher single grain chip thicknesses until a critical value of 0.25 mu m is achieved, from which a stable behavior is observed. Grinding process can lead to an increase in the fracture toughness from similar to 7 to similar to 12 MPa m(1/2), while compressive residual stresses change from similar to 300 to similar to 900 MPa. (AU)

• Processo FAPESP: 15/15622-2 - Influência dos parâmetros de retificação na fabricação de insertos de metal duro sobre seu desempenho no torneamento de uma liga de titânio
• Beneficiário: Carlos Eiji Hirata Ventura
• Modalidade de apoio: Auxílio à Pesquisa - Jovens Pesquisadores
• Processo FAPESP: 17/12304-5 - EMU concedido no processo 15/15622-2: retificadora CNC para preparação de insertos de corte
• Beneficiário: Carlos Eiji Hirata Ventura
• Modalidade de apoio: Auxílio à Pesquisa - Programa Equipamentos Multiusuários
• Processo FAPESP: 17/12309-7 - EMU concedido no processo 15/15622-2: microscópio para análise de imagens tridimensionais
• Beneficiário: Carlos Eiji Hirata Ventura
• Modalidade de apoio: Auxílio à Pesquisa - Programa Equipamentos Multiusuários