Innovative Vertical Coupling Photonic Packaging Using Additive Technology

Autor(es)

Finardi, Celio Antonio ; Biazoli, Claudecir Ricardo ; Cyrino Mattar, Jose Eduardo ; Hernandez-Figueroa, Hugo E. ; Panepucci, Roberto Ricardo

• Tipo de documento: Artigo Científico
• Fonte: 2024 SBFOTON INTERNATIONAL OPTICS AND PHOTONICS CONFERENCE, SBFOTON IOPC 2024; v. N/A, p. 3-pg., 2024-01-01.

Resumo

Coupling light to and from optical fibers is a challenge for silicon photonic due to size differences and mechanical complexity. This paper addresses the development of packaging for vertical (off-plane) coupling using 3D printing. We demonstrated that additive technology can be used to manufacture fiber arrays and vertical coupling packaging platforms, simplifying photonic packaging and enabling rapid and cost-effective customization and prototyping. Results of 250 mu m resin fiber arrays are presented, describing the groove fabrication, fiber array assembly and their dimensional/optical characterization. Silicon photonic IC packaging is also shown, and evolution of these developments is mentioned. (AU)

• Processo FAPESP: 21/11380-5 - CPTEn - Centro Paulista de Estudos da Transição Energética
• Beneficiário: Luiz Carlos Pereira da Silva
• Modalidade de apoio: Auxílio à Pesquisa - Centros de Ciência para o Desenvolvimento