The influence of die geometry on stress distribution by experimental and FEM simulation on electrolytic copper wiredrawing

Autor(es)

Leonardo Kyo Kabayama ^[1] ; Simone Pereira Taguchi ^[2] ; Gustavo Aristides Santana Martínez ^[3]

Afiliação do(s) autor(es)

^[1] Universidade de São Paulo. , Engineering School of Lorena. Department of Materials Engineering - Brasil

^[2] Universidade de São Paulo. , Engineering School of Lorena. Department of Materials Engineering - Brasil

^[3] Universidade de São Paulo. , Engineering School of Lorena. Department of Materials Engineering - Brasil

• Tipo de documento: Artigo Científico
• Fonte: MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS; v. 12, n. 3, p. 281-285, 2009-09-00.

Resumo

The study of die geometry is vital in determining the surface and mechanical properties of drawn wires, and consequently, their application. In this work, annealed electrolytic copper wire (ETP), with 0.5 mm original diameter was reduced by 19% in dies with 2β = 10º and 18º and Hc = 35 and 50%. The best experimental results were then studied by the Finite Element Method to simulate residual stress distribution. The experimental results show that the friction coefficient decreases as the wire drawing speed increases, and that low 2β and Hc values bring about the most favorable wiredrawing conditions. The simulation shows a variation in the axial and radial tensions, both for the compression and traction stresses on all regions during the wire drawing process. In conclusion, the influence of the internal die geometry on the drawn wire is clarified. (AU)

• Processo FAPESP: 02/00834-4 - Introdução ao Marc aplicado ao processo de trefilação
• Beneficiário: Marcia Moreira Medeiros
• Modalidade de apoio: Bolsas no Brasil - Iniciação Científica