Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys

Autor(es)

Dias, Marcelino ^[1] ; Costa, Thiago A. ^[2] ; Soares, Thiago ^[1] ; Silva, Bismarck L. ^[3] ; Cheung, Noe ^[1] ; Spinelli, Jose E. ^[4] ; Garcia, Amauri ^[1]

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil

^[2] Fed Inst Educ Sci & Technol, BR-66093020 Belem, Para - Brazil

^[3] Fed Univ Rio Grande do Norte UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil

^[4] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: JOURNAL OF ELECTRONIC MATERIALS; v. 47, n. 2, p. 1647-1657, FEB 2018.
• Citações Web of Science: 0

Resumo

Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.55b-1Ag and Sn-5.5Sb-1Cu alloys to be determined. Extensive ranges of cooling rates were obtained, which permitted specific values of cooling rate for each sample examined along the length of the casting to be attributed. Very broad microstructural length scales were revealed as well as the presence of either cells or dendrites for the Ag-containing alloy. Hereafter, microstructural spacing values such as the cellular spacing, 2,, and the primary dendritic spacing, lambda(1), may be correlated with thermal solidification parameters, that is, the cooling rate and the growth rate. While, for the Cu-containing Sn-Sb alloy, the beta-Sn matrix is characterized only by the presence of dendritic arrangements, the Ag-containing Sn-Sb alloy is shown to have high-velocity beta-Sn cells associated with high cooling rate regions, i.e., positions closer to the bottom of the alloy casting, with the remaining positions being characterized by a complex growth of beta-Sn dendrites. Minor additions of Cu and Ag increase both the yield and ultimate tensile strengths when compared with the corresponding values of the binary Sn-5.5Sb alloy, with a small reduction in ductility. This has been attributed to the homogeneous distribution of the Ag3Sn and Cu6Sn5 intermetallic particles related to smaller 21 characterizing the dendritic zones of the ternary Sn-Sb(Cu,Ag) alloys. In addition, the Ag-modified Sn-Sb alloy exhibited an initial wetting angle consistent with that characterizing the binary Sn-5.5Sb alloy. (AU)

• Processo FAPESP: 13/09267-0 - Evolução microestrutural na solidificação transitória de ligas monofásicas e peritéticas Sn-Sb (e Sn-Sb-X) para soldagem e em camadas interfaciais solda/substrato
• Beneficiário: José Marcelino da Silva Dias Filho
• Modalidade de apoio: Bolsas no Brasil - Doutorado
• Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 16/18186-1 - Evolução microestrutural e resistências mecânica e ao desgaste de ligas ternárias Al-Bi-Si e Al-Bi-Ni solidificadas unidirecionalmente
• Beneficiário: José Marcelino da Silva Dias Filho
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado