The effect of surface pretreatment on the corrosion behaviour of silanated AA2198-T851 Al-Cu-Li alloy

Autor(es)

Donatus, Uyime ^[1] ; Klumpp, Rafael Emil ^[1] ; Vardan Mogili, Naga Vishnu ^[2] ; Antunes, Renato Altobelli ^[3] ; Milagre, Mariana Xavier ^[1] ; Costa, Isolda ^[1]

Afiliação do(s) autor(es)

^[1] Inst Pesquisas Energet & Nucl, Av Prof Lineu Prestes, BR-2242 Sao Paulo - Brazil

^[2] Ctr Nacl Pesquisas Energia & Mat CNPEM, Lab Nacl Nanotecnol LNNano, Rua Giuseppe MaximoScolfaro 10-000, BR-13083100 Campinas, SP - Brazil

^[3] Univ Fed ABC UFABC, Ctr Engn Modelagem & Ciencias Sociais Aplicadas C, BR-09210580 Santo Andre, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: SURFACE AND INTERFACE ANALYSIS; v. 51, n. 2, p. 275-289, FEB 2019.
• Citações Web of Science: 0

Resumo

The corrosion behaviour of silanated AA2198-T851 alloy substrates with and with no manufacturing-process induced near-surface deformed layer (MPI-NSDL) has been investigated. Two methods (alkaline etching + desmutting and mechanical polishing) were employed in removing the MPI-NSDL. Silanization was performed using 2-bis-triethoxysilylethane. Electrochemical impedance spectroscopy (EIS), salt spray test, and microscopy techniques were employed in the investigation of the corrosion behaviours. The studies revealed that polishing appeared to be the best silanating pre-treatment (compared with degreasing and etching + desmutting) for the new generation AA2198-T851 Al-Cu-Li alloy, and this was reflected in the EIS spectra. The etched + desmutted and the degreased surface with MPI-NSDL did not respond well to silanization and presented more pitting sites per square millimeter. However, the severity of corrosion per pit was more on the polished sample compared with the other two. Also, the corrosion mechanisms were different for the three cases. (AU)

• Processo FAPESP: 17/03095-3 - Investigação da suscetibilidade à corrosão de ligas Al-Cu-Li com solda por atrito (FSW) utilizando a técnica de varredura do eletrodo vibratório (SVET)
• Beneficiário: Uyime Donatus
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado