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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Slow and rapid cooling of Al-Cu-Si ultrafine eutectic composites: Interplay of cooling rate and microstructure in mechanical properties

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Autor(es):
de Gouveia, Guilherme Lisboa [1] ; Kakitani, Rafael [2] ; Gomes, Leonardo Fernandes [1] ; Moreira Afonso, Conrado Ramos [1] ; Cheung, Noe [2] ; Spinelli, Jose Eduardo [1]
Número total de Autores: 6
Afiliação do(s) autor(es):
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[2] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
Número total de Afiliações: 2
Tipo de documento: Artigo Científico
Fonte: Journal of Materials Research; v. 34, n. 8, p. 1381-1394, APR 29 2019.
Citações Web of Science: 0
Resumo

Ternary Al-15 wt% Cu-7 wt% Si and Al-22 wt% Cu-7 wt% Si alloy specimens were generated by transient directional solidification (DS) and rapid solidification (RS) techniques. The microstructures are constituted by an alpha-Al dendritic matrix surrounded by two eutectic, that is, a binary eutectic (Si + alpha-Al) and a bimodal eutectic, consisting of cellular-type binary eutectic colonies (alpha-Al + Al2Cu) in a ternary eutectic matrix consisting of alpha-Al + Al2Cu + Si. The bimodal eutectic exists at cooling rates from 0.5 to 250 K/s. The secondary dendritic spacing, lambda(2), of the DS samples varied from 5 to 20 mu m and from 10 to 18 mu m for both examined alloys. The lambda(2) from 2.7 to 4.0 mu m characterized the RS samples. Mechanical properties have been determined for various samples related to different dendritic spacing values. Based on the evaluation of the rapidly solidified microstructures, it was possible to assess the cooling rates. (AU)

Processo FAPESP: 17/12741-6 - Aplicação de técnicas experimentais de solidificação, caracterização microestrutural e de propriedades na avaliação de ligas eutéticas e hipereutéticas à base de Al e Zn
Beneficiário:José Eduardo Spinelli
Modalidade de apoio: Auxílio à Pesquisa - Regular