Fractographic analysis of scarf repaired carbon/epoxy laminates submitted to tensile strength

Autor(es)

Zanetine Marques, Thais Peres ^[1] ; Mayer, Sergio ^[2] ; Candido, Geraldo Mauricio ^[2] ; Rezende, Mirabel Cerqueira ^{[1, 2]}

Afiliação do(s) autor(es)

^[1] Fed Univ Sao Paulo UNIFESP, Inst Sci & Technol, Rua Talim 330, BR-12231280 Sao Jose Dos Campos, SP - Brazil

^[2] Aeronaut Inst Technol ITA, Praca Marechal Eduardo Gomes 50, BR-12228900 Sao Jose Dos Campos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: ENGINEERING FAILURE ANALYSIS; v. 124, JUN 2021.
• Citações Web of Science: 0

Resumo

This study presents the main fractographic aspects and failure modes involved on the fracture of scarf repaired laminates submitted to tensile test, using scanning electron microscopy (SEM) technique. A detailed analysis of the fractographic aspects was carried out correlating them to the failure modes, the local crack propagation, and the mechanical performance of the scarf joint. SEM analyses showed cohesive failure of the adhesive film associated with a strong mechanical anchoring between the adhesive and the laminate, as well as a good patch ply consolidation on the adhesive interface, showing the joining mechanism efficiency. Fiber pull-out mechanism associated with the translaminar fracture, combined with intralaminar fracture were the predominant failure modes observed in the parent laminate and in the patch repaired region, evidencing the complexity on crack growing in woven fabric composite materials. Fractographic analyses provide evidences that justify the good mechanical behavior of the repaired laminates that is attributed to high interfacial shear strength of the scarf joint and overall good quality of the repair manufacturing process. (AU)

• Processo FAPESP: 18/09531-2 - Desenvolvimento de compósitos verdes nanoestruturados multifuncionais baseados em poli(álcool furfurílico)/nanolâminas de grafite para aplicações aeroespaciais
• Beneficiário: Mirabel Cerqueira Rezende
• Modalidade de apoio: Auxílio à Pesquisa - Regular