Effects of Sn, Gd, and Mn additions on the surface chemistry and electrochemical behavior of CuAl-based alloys in sodium chloride solution

Autor(es)

de Souza, Juliana Sarango ^[1] ; de Oliveira, Mara Cristina Lopes ^[2] ; Antunes, Renato Altobelli ^[2] ; da Silva, Ricardo Alexandre Galdino ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Paulo UNIFESP, Inst Ciencias Ambientais Quim Farmaceut, BR-09910720 Diadema, SP - Brazil

^[2] Fed Univ ABC UFABC, Ctr Engn Modelagem Ciencias Sociais Aplicadas CEC, BR-09210580 Santo Andre, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Applied Surface Science; v. 573, JAN 30 2022.
• Citações Web of Science: 0

Resumo

In the present work, the effects of Gd, Mn, and Sn additions on the surface chemistry and the electrochemical behavior of CuAl-based shape memory alloys were studied. Alloys were produced by arc furnace melting. The corrosion behavior was evaluated by electrochemical impedance spectroscopy (EIS) in 3.5 wt% NaCl solution up to 24 h of immersion. The surface chemical states were assessed by X-ray photoelectron spectroscopy (XPS). Correlation between the corrosion behavior and the surface chemistry is discussed. Gd addition increased the corrosion resistance of the CuAl-base alloy. Mn and Sn additions led to the formation of non-protective oxide films. (AU)

• Processo FAPESP: 19/06717-0 - Estudo da estabilidade de fases em ligas multicomponentes
• Beneficiário: Ricardo Alexandre Galdino da Silva
• Modalidade de apoio: Auxílio à Pesquisa - Regular