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Entree


Photonic Integrated Circuit Design and Packaging for Submarine Optical Amplification

Autor(es):
de Farias, Giovanni B. ; Moura, Uiara C. ; Sampaio Januario, Joao Carlos ; Argentato, Marcio C. ; Rossi, Sandro M. ; IEEE
Número total de Autores: 6
Tipo de documento: Artigo Científico
Fonte: 2018 IEEE 7TH INTERNATIONAL CONFERENCE ON PHOTONICS (ICP); v. N/A, p. 3-pg., 2018-01-01.
Resumo

This paper gives an insight into a Brazilian project which aims to develop a photonic integrated circuit (PIC) and packaging for submarine optical repeaters. The PIC design in order to achieve single-mode operation in both 980nm and 1.55 mu m is detailed. A high-reliability packaging technique is demonstrated. A transmission experiment with 200Gbps 16-QAM signal is achieved using the optical amplifier with the PIC. (AU)

Processo FAPESP: 16/20615-8 - Tecnologias de Dispositivos Fotônicos para Transceptores ópticos avançados 100Gbps e além
Beneficiário:Giovanni Benincá de Farias
Modalidade de apoio: Auxílio à Pesquisa - Regular