Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution

Autor(es)

Osorio, Wislei R. ^{[1, 2]} ; Freitas, Emmanuelle S. ^[2] ; Spinelli, Jose E. ^[3] ; Garcia, Amauri ^[2]

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, UNICAMP, Sch Appl Sci FCA, BR-13484350 Limeira, SP - Brazil

^[2] Univ Estadual Campinas, UN1CAMP, Dept Mat Engn, BR-13083970 Campinas, SP - Brazil

^[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Corrosion Science; v. 80, p. 71-81, MAR 2014.
• Citações Web of Science: 20

Resumo

Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 degrees C It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (i(corr)) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on i(corr), is also discussed. (C) 2013 Elsevier Ltd. All rights reserved. (AU)

• Processo FAPESP: 13/15478-3 - Inter-relação entre Parâmetros Térmicos e Microestruturais da Solidificação e Comportamento Tribocorrosivo de Ligas Al-Zn(Mg) e Zn-Mg
• Beneficiário: Emmanuelle Sá Freitas Feitosa
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado