| Full text | |
| Author(s): |
Total Authors: 4
|
| Affiliation: | [1] Univ Estadual Campinas, UNICAMP, Sch Appl Sci FCA, BR-13484350 Limeira, SP - Brazil
[2] Univ Estadual Campinas, UN1CAMP, Dept Mat Engn, BR-13083970 Campinas, SP - Brazil
[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 3
|
| Document type: | Journal article |
| Source: | Corrosion Science; v. 80, p. 71-81, MAR 2014. |
| Web of Science Citations: | 20 |
| Abstract | |
Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 degrees C It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (i(corr)) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on i(corr), is also discussed. (C) 2013 Elsevier Ltd. All rights reserved. (AU) | |
| FAPESP's process: | 13/15478-3 - Interrelation of Solidification Thermal and Microstructural Parameters and Tribocorrosive Behavior of Al-Zn(Mg) e Zn-Mg Alloys |
| Grantee: | Emmanuelle Sá Freitas Feitosa |
| Support Opportunities: | Scholarships in Brazil - Post-Doctoral |