Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its correlations with mechanical properties

• Grant number: 15/11863-5
• Support Opportunities: Regular Research Grants
• Start date: March 01, 2016
• End date: February 28, 2018
• Field of knowledge: Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
• Principal Investigator: José Eduardo Spinelli
• Grantee: José Eduardo Spinelli
• Host Institution: Centro de Ciências Exatas e de Tecnologia (CCET). Universidade Federal de São Carlos (UFSCAR). São Carlos , SP, Brazil
• City of the host institution: São Carlos

Abstract

The operational characteristics regarding the foundry process can definitely affect the final microstructure. Such characteristics of the process can be translated by the solidification thermal variables such as cooling rate and growth rate. The use of lead (Pb) is a drawback in the modern soldering industry, which is justified based on the high toxicity of lead. As a consequence, several alternative alloys are being proposed so that they could replace Sb-Pb based alloys. Binary and ternary Sn-Ni, Zn-Sn-Cu and Sn-Bi-Sb solder alloys seem to be promising materials to be examined. Chemistry variation and microstructures of these alloys are some aspects to be elucidated. In the case of ternary Al-Si-Cu, the effects of cooling rate on the morphology and distribution of the formed phases are still tasks to be accomplished. Thus, this project aims to characterize in details the microstructure evolutions of the mentioned metallic alloys directionally solidified under transient conditions. The wetting behavior is considered as an essential attribute for commercial solder alloys. Thus, the Zn and Sn based alloys will be characterized by contact angle determination. Functional relationships will be established regarding microstructure-thermal parameters-mechanical resistance. (AU)

Scientific publications

(19)

(The scientific publications listed on this page originate from the Web of Science or SciELO databases. Their authors have cited FAPESP grant or fellowship project numbers awarded to Principal Investigators or Fellowship Recipients, whether or not they are among the authors. This information is collected automatically and retrieved directly from those bibliometric databases.)

SILVA, BISMARCK LUIZ; EVANGELISTA DA SILVA, VITOR COVRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, n. 3, p. 1754-1769, MAR 2017. (13/08259-3, 15/11863-5)

GOMES, LEONARDO F.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 48A, n. 4, p. 1841-1855, APR 2017. (13/08259-3, 15/11863-5)

SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, JUN 2017. (13/08259-3, 15/11863-5)

DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, 2018. (17/15158-0, 16/18186-1, 17/12741-6, 15/11863-5)

REYES, RODRIGO V.; KAKITANI, RAFAEL; COSTA, THIAGO A.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al-Si alloy. PHILOSOPHICAL MAGAZINE LETTERS, v. 96, n. 6, p. 228-237, 2016. (15/11863-5, 14/50502-5)

SPINELLI, J. E.; BOGNO, A. -A.; HENEIN, H.. Two-Zone Microstructures in Al-18Si Alloy Powders. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 49A, n. 2, p. 550-562, FEB 2018. (16/10596-6, 15/11863-5)

SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal of Alloys and Compounds, v. 691, p. 600-605, JAN 15 2017. (13/08259-3, 15/11863-5)

LIMA, THIAGO SOARES; DE GOUVEIA, GUILHERME LISBOA; SEPTIMIO, RUDIMYLLA DA SILVA; DA CRUZ, CLARISSA BARROS; SILVA, BISMARCK LUIZ; BRITO, CRYSTOPHER; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. METALS, v. 9, n. 2, FEB 2019. (17/12741-6, 15/11863-5, 16/18186-1)

XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7, JUL 2018. (17/15158-0, 15/11863-5, 16/10596-6, 16/18186-1)

REYES, RODRIGO V.; BELLO, THOMAS S.; KAKITANI, RAFAEL; COSTA, THIAGO A.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 685, p. 235-243, FEB 8 2017. (15/03116-5, 15/11863-5)

CANTE, V, MANUEL; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. An Alternative to the Recycling of Fe-Contaminated Al. JOURNAL OF SUSTAINABLE METALLURGY, v. 4, n. 3, p. 412-426, SEP 2018. (16/10596-6, 15/11863-5, 17/12741-6, 17/16058-9)

KAKITANI, RAFAEL; REYES, RODRIGO V.; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Relationship between spacing of eutectic colonies and tensile properties of transient directionally solidified Al-Ni eutectic alloy. Journal of Alloys and Compounds, v. 733, p. 59-68, FEB 5 2018. (16/10596-6, 15/11863-5)

BISMARCK LUIZ SILVA; JOSÉ EDUARDO SPINELLI. Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 2, 2018-01-11. (15/11863-5, 17/12741-6, 16/18186-1)

SILVA, BISMARCK L.; XAVIER, MARCELLA G. C.; GARCIA, AMAMI; SPINENLLI, JOSE E.. Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 705, p. 325-334, SEP 29 2017. (16/10596-6, 15/11863-5)

SILVA, BISMARCK LUIZ; DESSI, JOAO GUILHERME; GOMES, LEONARDO FERNANDES; PERES, MAURICIO MIRDHAUI; CANTE, MANUEL VENCESLAU; SPINELLI, JOSE EDUARDO. Assessing microstructures and mechanical resistances of as-atomized and as-extruded samples of Al-1wt%Fe-1wt%Ni alloy. Journal of Alloys and Compounds, v. 691, p. 952-960, JAN 15 2017. (13/08259-3, 15/11863-5)

SANTOS, WASHINGTON L. R.; SILVA, BISMARCK L.; BERTELLI, FELIPE; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. An alternative thermal approach to evaluate the wettability of solder alloys. APPLIED THERMAL ENGINEERING, v. 107, p. 431-440, AUG 25 2016. (15/11863-5)

LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, SEP 2019. (17/15158-0, 16/10596-6, 15/11863-5, 17/12741-6)

SILVA, BISMARCK LUIZ; EVANGELISTA DA SILVA, VITOR COVRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 46, n. 3, p. 16-pg., 2017-03-01. (13/08259-3, 15/11863-5)

SPINELLI, J. E.; HEARN, W.; BOGNO, A. -A.; HENEIN, H.; MARTIN, O. A General Formulation of Eutectic Silicon Morphology and Processing History. LIGHT METALS 2018, v. N/A, p. 7-pg., 2018-01-01. (16/10596-6, 15/11863-5)