Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys

Autor(es)

Silva, Bismarck Luiz ^[1] ; Cheung, Noe ^[2] ; Garcia, Amauri ^[2] ; Spinelli, Jose Eduardo ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

^[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Materials Letters; v. 142, p. 163-167, MAR 1 2015.
• Citações Web of Science: 20

Resumo

Wettability is defined as the tendency of a liquid metal to spread on a solid surface. The solder/substrate thermal conductance represented by a heat transfer coefficient, h(i), states the heat ability to flow across the solder/substrate interface during solidification, being affected by the wettability. This letter aims to investigate the wetting behavior of Sn-0.7 wt%Cu-(Ni) lead-free solders by measuring the contact angles (theta) on a copper substrate as a function of the alloy Ni content. Furthermore, time-dependent h(i) profiles are determined from thermal readings during directional solidification (DS) of Sn-0.7 wt%Cu-(xNi) alloys. It is shown that a smaller initial contact angle (theta(i)=32.7) characterizes the Sn-0.7 wt%Cu-0.05 wt%Ni associated with the highest h(i) value of 11,500t(-032.7) w/m(2) K A (t: time). (C) 2014 Elsevier B.V. All rights reserved. (AU)

• Processo FAPESP: 13/13030-5 - Microestrutura, parâmetros térmicos, segregação e propriedades mecânicas de ligas alternativas de soldagem à base de Sn, Zn e Bi
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 13/08259-3 - Desenvolvimento microestrutural e do comportamento mecânico de ligas alternativas de soldagem Sn-Bi-Cu e Sn-Bi-Ag
• Beneficiário: Bismarck Luiz Silva
• Modalidade de apoio: Bolsas no Brasil - Doutorado