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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy

Texto completo
Autor(es):
Silva, Bismarck Luiz [1] ; Reinhart, Guillaume [2] ; Nguyen-Thi, Henri ; Mangelinck-Noel, Nathalie [3] ; Garcia, Amauri [4] ; Spinelli, Jose Eduardo [1]
Número total de Autores: 6
Afiliação do(s) autor(es):
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[2] Aix Marseille Univ, CNRS, IM2NP UMR 7334, F-13397 Marseille - France
[3] Henri Nguyen-Thi, Aix Marseille Univ, CNRS, IM2NP UMR 7334, F-13397 Marseille - France
[4] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil
Número total de Afiliações: 4
Tipo de documento: Artigo Científico
Fonte: MATERIALS CHARACTERIZATION; v. 107, p. 43-53, SEP 2015.
Citações Web of Science: 22
Resumo

Sn-Bi solders may be applied for electronic applications where low-temperature soldering is required, i.e., sensitive components, step soldering and soldering LEDs. In spite of their potential to cover such applications, the mechanical response of soldered joints of Sn-Bi alloys in some cases does not meet the strength requirements due to inappropriate resulting microstructures. Hence, careful examination and control of as-soldered microstructures become necessary with a view to pre-programming reliable final properties. The present study aims to investigate the effects of solidification thermal parameters (growth rate VI, and cooling rate TO on the microstructure of the Sn-52 wt%Bi solder solidified under unsteady-state conditions. Samples were obtained by upward directional solidification (DS), followed by characterization through metallography and scanning electron microscopy (SEM). The microstructures are shown to be formed by Sn-rich dendrites decorated with Bi precipitates surrounded by a complex regular eutectic mixture, with alternated Bi-rich and Sn-rich phases. Experimental correlations of primary (lambda(1)), secondary (lambda(2)), tertiary (lambda(3)) dendritic and eutectic spacings (lambda(coarse) and lambda(fine)) with cooling rate and growth rate are established. Two ranges of lamellar eutectic sizes were determined, described by two experimental equations lambda = 1.1 V-L(-1/2) and lambda = 0.67 V-L(-1/2). The onset of tertiary branches within the dendritic array along the Sn-52 wt.%Bi alloy DS casting is shown to occur for cooling rates lower than 1.5 degrees C/s. (C) 2015 Elsevier Inc. All rights reserved. (AU)

Processo FAPESP: 13/13030-5 - Microestrutura, parâmetros térmicos, segregação e propriedades mecânicas de ligas alternativas de soldagem à base de Sn, Zn e Bi
Beneficiário:José Eduardo Spinelli
Linha de fomento: Auxílio à Pesquisa - Regular
Processo FAPESP: 13/08259-3 - Desenvolvimento microestrutural e do comportamento mecânico de ligas alternativas de soldagem Sn-Bi-Cu e Sn-Bi-Ag
Beneficiário:Bismarck Luiz Silva
Linha de fomento: Bolsas no Brasil - Doutorado