Microstructural and mechanical properties analysis of extruded Sn-0.7Cu solder alloy

Autor(es)

Bogno, Abdoul-Aziz ; Spinelli, Jose Eduardo ; Moreira Afonso, Conrado Ramos ; Henein, Hani

• Tipo de documento: Artigo Científico
• Fonte: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T; v. 4, n. 1, p. 84-92, JAN-MAR 2015.
• Citações Web of Science: 8

Resumo

The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn-0.7 wt.%Cu droplets generated by impulse atomization (IA) were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD) and scanning electron microscopy (SEM). In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn-0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2-3x higher than that obtained for the directionally solidified samples. (C) 2014 Brazilian Metallurgical, Materials and Mining Association. Published by Elsevier Editora Ltda. All rights reserved. (AU)

• Processo FAPESP: 13/50375-0 - Microstructural analysis of Sn-Cu and Sn-Ag-Cu lead free solder alloys under fast and slow cooling
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular