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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

The effects of Zn segregation and microstructure length scale on the corrosion behavior of a directionally solidified Mg-25 wt.%Zn alloy

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Autor(es):
Verissimo, Nathalia C. ; Freitas, Emmanuelle S. ; Cheung, Noe ; Garcia, Amauri ; Osorio, Wislei R.
Número total de Autores: 5
Tipo de documento: Artigo Científico
Fonte: Journal of Alloys and Compounds; v. 723, p. 649-660, NOV 5 2017.
Citações Web of Science: 16
Resumo

Biodegradable implants can be used in order to avoid removal surgery. Mg-Zn alloys are considered interesting alternatives for biomedical applications, however, studies concerning the effects of microstructural features in the as-solidified condition and segregation aspects on the resulting electrochemical behavior are scarce. This investigation is focused on the evaluation of the electrochemical corrosion of an as-solidified Mg-25 wt.% Zn alloy in a 0.15 M NaCl solution at 25 degrees C. EIS plots, potentiodynamic polarization curves and equivalent circuits are used. It is shown that Zn segregation affects both the galvanic couple and the cathode-to-anode area ratio. It was found that finer and homogeneously distributed Mg-rich six-fold branched equiaxed dendritic grains induce lower corrosion current density and higher polarization resistance when compared with equivalent results of coarser ones. (C) 2017 Elsevier B.V. All rights reserved. (AU)

Processo FAPESP: 13/23396-7 - Efeitos de parâmetros da microestrutura de solidificação de ligas multicomponentes à base de alumínio (Al-Mg-Si; Al-Sn-Cu; Al-Zn-Mg) nas resistências à degradação por corrosão e tribocorrosão
Beneficiário:Amauri Garcia
Linha de fomento: Auxílio à Pesquisa - Regular
Processo FAPESP: 14/50502-5 - Interrelation of thermal and microstructural solidification parameters and corrosion/tribocorrosion behavior of alloys for tribological, biomedical and solder applications
Beneficiário:Amauri Garcia
Linha de fomento: Auxílio à Pesquisa - Regular