Microstructural Characterization of a Laser Surface Remelted Cu-Based Shape Memory Alloy

Autor(es)

Murillo Romero da Silva ^[1] ; Piter Gargarella ^[2] ; Witor Wolf ^[1] ; Tobias Gustmann ^[3] ; Claudio Shyinti Kiminami ^[2] ; Simon Pauly ^[3] ; Jürgen Eckert ; Claudemiro Bolfarini ^[2]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Carlos, Programa Posgrad Ciencia & Engn Mat, Rodovia Washington Luis, Km 235, BR-13565905 Sao Carlos, SP - Brazil

^[2] Univ Fed Sao Carlos, Dept Engn Mat, Rodovia Washington Luis, Km 235, BR-13565905 Sao Carlos, SP - Brazil

^[3] Leibniz Inst Festkorper & Werkstoffforsch Dresden, Inst Komplexe Mat, Helmholtzstr 20, D-01069 Dresden, Sachsen - Germany

• Tipo de documento: Artigo Científico
• Fonte: MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS; v. 21, n. 3 2018-04-12.

Resumo

Cu-based shape memory alloys (SMAs) present some advantages as higher transformation temperatures, lower costs and are easier to process than traditional Ti-based SMAs but they also show some disadvantages as low ductility and higher tendency for intergranular cracking. Several studies have sought for a way to improve the mechanical properties of these alloys and microstructural refinement has been frequently used. It can be obtained by laser remelting treatments. The aim of the present work was to investigate the influence of the laser surface remelting on the microstructure of a Cu-11.85Al-3.2Ni-3Mn (wt%) SMA. Plates were remelted using three different laser scanning speeds, i.e. 100, 300 and 500 mm/s. The remelted regions showed a T-shape morphology with a mean thickness of 52, 29 and 23 µm and an average grain size of 30, 29 and 23µm for plates remelted using scanning speed of 100, 300 and 500 mm/s, respectively. In the plates remelted with 100 and 300 mm/s some pores were found at the root of the keyhole due to the keyhole instability. We find that the instability of keyholes becomes more pronounced for lower scanning speeds. It was not observed any preferential orientation introduced by the laser treatment. (AU)

• Processo FAPESP: 13/05987-8 - Processamento e caracterização de ligas metálicas amorfas, metaestáveis e nano-estruturadas
• Beneficiário: Claudio Shyinti Kiminami
• Modalidade de apoio: Auxílio à Pesquisa - Temático
• Processo FAPESP: 15/04134-7 - Refusão superficial a laser da liga com memória de forma Cu-11.85Al-3.2Ni-3Mn (% peso)
• Beneficiário: Murillo Romero da Silva
• Modalidade de apoio: Bolsas no Brasil - Mestrado