Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate

Autor(es)

Silva, Bismarck L. ^[1] ; Garcia, Amauri ^[2] ; Spinelli, Jose E. ^[3]

Afiliação do(s) autor(es)

^[1] Fed Univ Rio Grande do Norte UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil

^[2] Univ Campinas UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil

^[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T; v. 8, n. 1, p. 1581-1586, JAN-MAR 2019.
• Citações Web of Science: 1

Resumo

Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (theta) several solders of interest became practical. Three Sn-0.7Cu-(1; 2 and 3Ag) and four Sn-34Bi-(OCu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both theta and cooling rate. An opposite correlation between cooling rate and theta is observed when Sn-34Bi and the Sn-34Bi-0.1Cu alloys are compared. (C) 2018 Brazilian Metallurgical, Materials and Mining Association. Published by Elsevier Editora Ltda. (AU)

• Processo FAPESP: 17/12741-6 - Aplicação de técnicas experimentais de solidificação, caracterização microestrutural e de propriedades na avaliação de ligas eutéticas e hipereutéticas à base de Al e Zn
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular