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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate

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Author(s):
Silva, Bismarck L. [1] ; Garcia, Amauri [2] ; Spinelli, Jose E. [3]
Total Authors: 3
Affiliation:
[1] Fed Univ Rio Grande do Norte UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil
[2] Univ Campinas UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 3
Document type: Journal article
Source: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T; v. 8, n. 1, p. 1581-1586, JAN-MAR 2019.
Web of Science Citations: 1
Abstract

Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (theta) several solders of interest became practical. Three Sn-0.7Cu-(1; 2 and 3Ag) and four Sn-34Bi-(OCu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both theta and cooling rate. An opposite correlation between cooling rate and theta is observed when Sn-34Bi and the Sn-34Bi-0.1Cu alloys are compared. (C) 2018 Brazilian Metallurgical, Materials and Mining Association. Published by Elsevier Editora Ltda. (AU)

FAPESP's process: 17/12741-6 - Application of experimental solidification techniques, characterization of microstructure and properties in the evaluation of eutectic and hypereutectic Al-base and Zn-base alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants