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The correlation between solidification microstructures and mechanical and tribological properties of Al-Sn-Cu and Al-Sn-Si alloys

Grant number: 14/21893-6
Support type:Scholarships abroad - Research Internship - Post-doctor
Effective date (Start): February 01, 2015
Effective date (End): April 30, 2015
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Transformation Metallurgy
Principal researcher:Amauri Garcia
Grantee:Felipe Bertelli
Supervisor abroad: Nathalie Mangelinck-Noel
Home Institution: Faculdade de Engenharia Mecânica (FEM). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
Research place: Institut Matériaux Microélectronique Nanosciences de Provence (Im2np), France  
Associated to the scholarship:12/16328-2 - The Correlation between Solidification Microstructures and Mechanical and Tribological Properties of Al-Sn-Cu and Al-Sn-Si Alloys, BP.PD

Abstract

The search of relationships between microstructural parameters and mechanical and wear behavior of alloys is fundamental for the pre-programming of final properties of as-cast components. Binary Al-Sn and Al-Si alloys, typically used for tribological applications, particularly for bearings and components of internal combustion engines, will need to be replaced with new alternatives caused by the design of new engines, which will be subjected to higher loads and velocities and hence will demand better properties to support the operation at higher temperatures. The present study aims to contribute to the understanding of modifications caused by a third alloying addition (Cu; Si), on the microstructural evolution and mechanical and tribological properties. The literature reports that Al-Sn-Si e Al-Sn-Cu alloys have a good potential for tribological applications due to the strengthening of the Al-rich matrix by Si and Cu and because the Sn particles act as a solid lubricant. However, the literature is scarce on detailed studies relating microstructure features on the mechanical and wear resistances. The way the scale of dendritic spacings is affected by alloying content and solidification kinetics will be investigated. These alloys will be directionally solidified under transient heat flow conditions for a wide range of cooling rates, both vertically upwards and downwards, with a view to permitting the effect of macrosegregation, evolution of microstructure and properties to be also analyzed. Both theoretical and experimental approaches will be used to quantify the effects of alloying on the solidification thermal variables: metal/mold heat transfer coefficient (h_i), tip growth rate (V_L), thermal gradient (G ), and cooling rate (T ). Experimental laws relating microstructural parameters to the mechanical and wear behavior will be developed. To complement the comprehension on the microstructure evolution of these alloys, the Bridgman growth of samples will be filmed in situ using X-ray techniques, either in the European Synchrotron Radiation Facility of Grenoble, or in the University of Marseille, France. (AU)

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Scientific publications
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
BERTELLI, FELIPE; CHEUNG, NOE; FERREIRA, IVALDO L.; GARCIA, AMAURI. Evaluation of thermophysical properties of Al-Sn-Si alloys based on computational thermodynamics and validation by numerical and experimental simulation of solidification. JOURNAL OF CHEMICAL THERMODYNAMICS, v. 98, p. 9-20, JUL 2016. Web of Science Citations: 4.
BERTELLI, FELIPE; BRITO, CRYSTOPHER; FERREIRA, IVALDO L.; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; CHEUNG, NOE; GARCIA, AMAURI. Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al-Sn-(Si;Cu) alloys. MATERIALS & DESIGN, v. 72, p. 31-42, MAY 5 2015. Web of Science Citations: 20.

Please report errors in scientific publications list by writing to: cdi@fapesp.br.