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Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys

Grant number: 13/08259-3
Support type:Scholarships in Brazil - Doctorate
Effective date (Start): August 01, 2013
Effective date (End): October 31, 2016
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
Principal Investigator:José Eduardo Spinelli
Grantee:Bismarck Luiz Silva
Home Institution: Centro de Ciências Exatas e de Tecnologia (CCET). Universidade Federal de São Carlos (UFSCAR). São Carlos , SP, Brazil
Associated scholarship(s):15/18689-0 - Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys, BE.EP.DR

Abstract

Sn-Bi solder alloys seem to be promising for replacing traditional Pb-based alloys. Low melting point and low relative costs characterize such alternative alloys, which are quite important factors to be considered for applications in microelectronics. However, unsuitable mechanical properties and low wettability are some drawbacks faced by such alloys. Microadditions containing Ag and Cu may improve these properties according to literature. The present work aims to evaluate the effects of adding Cu and Ag on the Sn-Bi based alloys during transient directional solidification. The results will include: mechanical properties, macrostructure, microstructure, thermal parameters during solidification, macrosegregation, X-ray diffraction. The expected large range of cooling rates will allow a complete evaluation of interrelations among microstructure and mentioned parameters to be performed. (AU)

Scientific publications (13)
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, JUN 2017. Web of Science Citations: 3.
GOMES, LEONARDO F.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E. Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 48A, n. 4, p. 1841-1855, APR 2017. Web of Science Citations: 6.
SILVA, BISMARCK LUIZ; EVANGELISTA DA SILVA, VITOR COVRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, n. 3, p. 1754-1769, MAR 2017. Web of Science Citations: 9.
SILVA, BISMARCK LUIZ; DESSI, JOAO GUILHERME; GOMES, LEONARDO FERNANDES; PERES, MAURICIO MIRDHAUI; CANTE, MANUEL VENCESLAU; SPINELLI, JOSE EDUARDO. Assessing microstructures and mechanical resistances of as-atomized and as-extruded samples of Al-1wt%Fe-1wt%Ni alloy. Journal of Alloys and Compounds, v. 691, p. 952-960, JAN 15 2017. Web of Science Citations: 2.
SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal of Alloys and Compounds, v. 691, p. 600-605, JAN 15 2017. Web of Science Citations: 18.
SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. MATERIALS CHARACTERIZATION, v. 114, p. 30-42, APR 2016. Web of Science Citations: 14.
SILVA, BISMARCK LUIZ; BERTELLI, FELIPE; CANTE, MANUEL V.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 27, n. 2, p. 1994-2003, FEB 2016. Web of Science Citations: 7.
SILVA, BISMARCK LUIZ; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy. MATERIALS CHARACTERIZATION, v. 107, p. 43-53, SEP 2015. Web of Science Citations: 22.
SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient. Journal of Alloys and Compounds, v. 632, p. 274-285, MAY 25 2015. Web of Science Citations: 19.
SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys. Materials Letters, v. 142, p. 163-167, MAR 1 2015. Web of Science Citations: 20.
SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy. MICROELECTRONICS RELIABILITY, v. 54, n. 12, p. 2929-2934, DEC 2014. Web of Science Citations: 5.
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, OCT 2014. Web of Science Citations: 7.
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 43, n. 5, p. 1347-1361, MAY 2014. Web of Science Citations: 16.

Please report errors in scientific publications list by writing to: cdi@fapesp.br.