Evaluation of alloys for thermal interface contact and for additive manufacturing

• Grant number: 19/23673-7
• Support type: Regular Research Grants
• Duration: November 01, 2020 - October 31, 2022
• Field of knowledge: Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
• Principal researcher: José Eduardo Spinelli
• Grantee: José Eduardo Spinelli
• Home Institution: Centro de Ciências Exatas e de Tecnologia (CCET). Universidade Federal de São Carlos (UFSCAR). São Carlos , SP, Brazil

Abstract

The present purpose aims to investigate research gaps identified in two important sectors of industry. Firstly, solidification of Sn-Bi(-In) solder alloys must be examined in copper substrates. In this case, the focus will be at the formed interfaces as a result of either solidification or localized reactions at the interface. This project will propose techniques in order to optimize the microstructure and application properties such as mechanical and corrosion resistances. These properties are crucial for thermal interfaces applied for heat dissipation. These materials are termed as TIM (Thermal Interface Materials). Pb-free TIM alloys such as Sn-Bi based ones are required nowadays due to the need of electronic devices having higher processing capabilities. The result is the need of increase heat release, i.e., more efficient and reliable TIM alloys. With this in mind, various factors must be accomplished, that is: wettability, thickness and nature of the reaction layers, Cu dissolution and microstructures. Secondly, determination of inter-relations type microstructure à processing parameters à properties remains essential for aluminium alloys with potential application in additive manufacturing (AM). For most of the alloys of interest (i.e., Al-10%Si-Mg-(Sc, Ni) and Al-5%Mg(-Sc) alloys), fundamental solidification parameters in order to control the process remain undetermined. One of the major contributions of this project will be establishing process maps so that connection between microstructure and parameters/properties could be established. Various techniques will be applied, which are: wettability (in the case of TIM alloys), corrosion, tensile and hardness tests. The characterization of intermetallic particles formed during solidification of the alloys of interest is also a concern which will be explored in this work. Intermetallics formed either at the interfaces of the Sn-Bi(-In)/substrate couples or those constituting the bulk multicomponent Al alloys will be assessed. Both thermodynamic computations and advanced microscopy will be employed in this regard. Efforts on examining the effects of Sc during age hardening of the AM alloys will be also focused on. (AU)

Scientific publications

(15)

(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)

GOMES, LEONARDO FERNANDES; KUGELMEIER, CRISTIE LUIS; DELLA ROVERE, CARLOS ALBERTO; SPINELLI, JOSE EDUARDO. ffects of Ag addition and dendritic scale on the corrosion behavior of the hypoeutectic Al-5wt% Si allo. Journal of Applied Electrochemistry, v. 52, n. 4, p. 653-665, APR 2022. Web of Science Citations: 0.

KAKITANI, RAFAEL; PINTO DA SILVA, CASSIO AUGUSTO; SILVA, BISMARCK; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys. SOLDERING & SURFACE MOUNT TECHNOLOGY, v. 34, n. 1, p. 24-30, JAN 3 2022. Web of Science Citations: 0.

SCHON, ALINE FERREIRA; CASTRO, NICOLAU APOENA; BARROS, ANDRE DOS SANTOS; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; CHEUNG, NOE; SILVA, BISMARCK LUIZ. Multiple linear regression approach to predict tensile properties of Sn-Ag-Cu (SAC) alloys. Materials Letters, v. 304, DEC 1 2021. Web of Science Citations: 0.

GOMES, LEONARDO FERNANDES; KUGELMEIER, CRISTIE LUIS; GARCIA, AMAURI; DELLA ROVERE, CARLOS ALBERTO; SPINELLI, JOSE EDUARDO. Influences of alloying elements and dendritic spacing on the corrosion behavior of Al-Si-Ag alloys. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 15, p. 5880-5893, NOV-DEC 2021. Web of Science Citations: 0.

DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Tailoring microstructure and tensile properties of Mg-Si alloys varying solidification cooling rate and Si content. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 825, SEP 21 2021. Web of Science Citations: 0.

DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Towards a morphological control of Mg2Si and superior tensile properties of high-Zn Mg-0.6Si (-Zn) alloys. Materials Letters, v. 299, SEP 15 2021. Web of Science Citations: 0.

XAVIER, MARCELLA G. C.; FREITAS, BRENDA J. M.; GOUVEIA, GUILHERME L.; GARCIA, AMAURI; SPINELLI, JOSE E. The Roles of Ni and Co in Dendritic Growth and Tensile Properties of Fe-Containing Al-Si-Cu-Zn Scraps under Slow and Fast Solidification Cooling. ADVANCED ENGINEERING MATERIALS, SEP 2021. Web of Science Citations: 0.

KAKITANI, RAFAEL; OLIVEIRA, RICARDO; REYES, RODRIGO V.; RODRIGUES, ADILSON V.; BERTELLI, FELIPE; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Metal/mold thermal conductance affecting ultrafine scale microstructures in aluminum eutectic alloys. CASE STUDIES IN THERMAL ENGINEERING, v. 26, AUG 2021. Web of Science Citations: 0.

GANDOLFI, MARESSA; CAVALCANTE XAVIER, MARCELLA GAUTE; GOMES, LEONARDO FERNANDES; VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Relationship between Microstructure Evolution and Tensile Properties of AlSi10Mg Alloys with Varying Mg Content and Solidification Cooling Rates. METALS, v. 11, n. 7 JUL 2021. Web of Science Citations: 0.

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; SILVA, BISMARCK; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Microstructural and segregation effects affecting the corrosion behavior of a high-temperature Bi-Ag solder alloy in dilute chloride solution. Journal of Applied Electrochemistry, v. 51, n. 5, p. 769-780, MAY 2021. Web of Science Citations: 0.

SOARES, THIAGO; CRUZ, CLARISSA; XAVIER, MARCELLA; REYES, V, RODRIGO; BERTELLI, FELIPE; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates. Journal of Alloys and Compounds, v. 860, APR 15 2021. Web of Science Citations: 0.

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, FEB 2021. Web of Science Citations: 0.

GOMES, LEONARDO FERNANDES; SILVA, BISMARCK LUIZ; DA SILVA, JR., PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Ag-containing aluminum-silicon alloys as an alternative for as-cast components of electric vehicles. MATERIALS RESEARCH EXPRESS, v. 8, n. 1 JAN 2021. Web of Science Citations: 0.

GOUVEIA, GUILHERME L.; GOMES, LEONARDO F.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E. Mechanical Properties, Microstructural Features, and Correlations with Solidification Rates of Al-Cu-Si Ultrafine Eutectic Alloys. ADVANCED ENGINEERING MATERIALS, v. 23, n. 4 JAN 2021. Web of Science Citations: 0.

VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluating Microstructure, Wear Resistance and Tensile Properties of Al-Bi(-Cu, -Zn) Alloys for Lightweight Sliding Bearings. METALS, v. 11, n. 1 JAN 2021. Web of Science Citations: 0.