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Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact

Grant number: 17/15158-0
Support type:Regular Research Grants
Duration: October 01, 2017 - September 30, 2019
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
Principal researcher:Amauri Garcia
Grantee:Amauri Garcia
Home Institution: Faculdade de Engenharia Mecânica (FEM). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
Assoc. researchers:Noe Cheung

Abstract

The present project aims to investigate a known gap in the literature concerning alloys for thermal interface applications. It is the purpose of the project to study optimization techniques through solidification in order to design the microstructure and appropriate application properties such as mechanical and corrosion resistances of alloys for thermal interfaces applied for heat dissipation, which are part of materials known as TIM (Thermal Interface Materials). The need of electronic devices of increasingly processing capability implies in increase of heat release, thus requiring the search for efficient and Pb-free TIM alloys. Along the thermal joint production, the TIM alloys are placed over a substrate and solidify under high cooling rates and transient heat flow conditions. Besides a good thermal contact between the alloy and the substrates, adequate mechanical and corrosion resistances are required in order to preserve the long-term integrity bond of the components. In this sense, in addition to the wetting tests of the alloys over different substrates used by the electronics industry, mechanical (tensile and hardness) and corrosion tests will be carried out. Furthermore, the application of a theoretical-experimental approach in order to determine the heat transfer coefficient at the alloy/substrate interface zone, with a view to permiting its correlation with the alloy wettability, and the characterization of intermetallics formed due to the metallurgical interaction at the TIM/substrate interface are also envisaged. (AU)

Scientific publications (21)
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
SOARES, THIAGO; CRUZ, CLARISSA; XAVIER, MARCELLA; REYES, V, RODRIGO; BERTELLI, FELIPE; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates. Journal of Alloys and Compounds, v. 860, APR 15 2021. Web of Science Citations: 0.
SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; SILVA, BISMARCK; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Microstructural and segregation effects affecting the corrosion behavior of a high-temperature Bi-Ag solder alloy in dilute chloride solution. Journal of Applied Electrochemistry, v. 51, n. 5 FEB 2021. Web of Science Citations: 0.
SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, FEB 2021. Web of Science Citations: 0.
DIAS, MARCELINO; VERISSIMO, NATHALIA C.; REGONE, NATAL N.; FREITAS, EMMANUELLE S.; CHEUNG, NOE; GARCIA, AMAURI. Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, JUL 2020. Web of Science Citations: 0.
SEPTIMIO, RUDIMYLLA S.; ARENAS, MARIA A.; CONDE, ANA; GARCIA, AMAURI; CHEUNG, NOE; DE DAMBORENEA, JUAN. Galvanic corrosion analysis of a Bi-Zn solder alloy coupled to Ni and Cu substrates. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, JUL 2020. Web of Science Citations: 0.
CRUZ, CLARISSA; LIMA, THIAGO; KAKITANI, RAFAEL; BARROS, ANDRE; GARCIA, AMAURI; CHEUNG, NOE. Plate-like growth in a eutectic Bi-Ni alloy: effects of morphological microstructure evolution and Bi3Ni intermetallic phase on tensile properties. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 9, n. 3, p. 4940-4950, MAY-JUN 2020. Web of Science Citations: 0.
CRUZ, CLARISSA; LIMA, THIAGO; SOARES, MARCO; FREITAS, EMMANUELLE; FUJIWARA, ERIC; GARCIA, AMAURI; CHEUNG, NOE. Effect of Microstructure Features on the Corrosion Behavior of the Sn-2.1 wt%Mg Solder Alloy. ELECTRONIC MATERIALS LETTERS, v. 16, n. 3 JAN 2020. Web of Science Citations: 0.
CURTULO, JOANISA P.; DIAS, MARCELINO; BERTELLI, FELIPE; SILVA, BISMARCK L.; SPINELLI, JOSE E.; GARCIA, AMAURI; CHEUNG, NOE. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates. JOURNAL OF MANUFACTURING PROCESSES, v. 48, p. 164-173, DEC 2019. Web of Science Citations: 2.
DA CRUZ, CLARISSA B.; LIMA, THIAGO S.; COSTA, THIAGO A.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE. Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness. MATERIALS RESEARCH EXPRESS, v. 6, n. 12 DEC 2019. Web of Science Citations: 0.
KAKITANI, RAFAEL; CRUZ, CLARISSA B.; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE. Transient directional solidification of a eutectic Al-Si-Ni alloy: Macrostructure, microstructure, dendritic growth and hardness. MATERIALIA, v. 7, SEP 2019. Web of Science Citations: 3.
LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, SEP 2019. Web of Science Citations: 1.
SEPTIMIO, RUDIMYLLA S.; ARENAS, MARIA A.; CONDE, ANA; GARCIA, AMAURI; CHEUNG, NOE; DE DAMBORENEA, JUAN. Correlation between microstructure and corrosion behaviour of Bi-Zn solder alloys. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, v. 54, n. 4, p. 362-368, MAY 19 2019. Web of Science Citations: 0.
ROCHA, O. L.; COSTA, T. A.; DIAS, M.; GARCIA, A. Cellular/dendritic transition, dendritic growth and microhardness in directionally solidified monophasic Sn-2%Sb alloy. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, v. 28, n. 8, p. 1679-1686, AUG 2018. Web of Science Citations: 2.
XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7 JUL 2018. Web of Science Citations: 0.
DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, FEB 2018. Web of Science Citations: 0.
DIAS, MARCELINO; COSTA, THIAGO A.; SILVA, BISMARCK L.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. MICROELECTRONICS RELIABILITY, v. 81, p. 150-158, FEB 2018. Web of Science Citations: 8.
SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, JAN 18 2018. Web of Science Citations: 5.
Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, n. ahead, p. -, 2018.
CLARISSA BARROS DA CRUZ; RAFAEL KAKITANI; MARCELLA GAUTÊ CAVALCANTE XAVIERB; BISMARCK LUIZ SILVA; AMAURI GARCIA; NOÉ CHEUNG; JOSÉ EDUARDO SPINELLI. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, p. -, 2018.
DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1 2018. Web of Science Citations: 1.
SEPTIMIO, RUDIMYLLA S.; COSTA, THIAGO A.; VIDA, TALITA A.; GARCIA, AMAURI; CHEUNG, NOE. Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys. MICROELECTRONICS RELIABILITY, v. 78, p. 100-110, NOV 2017. Web of Science Citations: 5.

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