Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact

• Grant number: 17/15158-0
• Support Opportunities: Regular Research Grants
• Start date: October 01, 2017
• End date: September 30, 2019
• Field of knowledge: Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
• Principal Investigator: Amauri Garcia
• Grantee: Amauri Garcia
• Host Institution: Faculdade de Engenharia Mecânica (FEM). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
• Associated researchers: Noe Cheung

Abstract

The present project aims to investigate a known gap in the literature concerning alloys for thermal interface applications. It is the purpose of the project to study optimization techniques through solidification in order to design the microstructure and appropriate application properties such as mechanical and corrosion resistances of alloys for thermal interfaces applied for heat dissipation, which are part of materials known as TIM (Thermal Interface Materials). The need of electronic devices of increasingly processing capability implies in increase of heat release, thus requiring the search for efficient and Pb-free TIM alloys. Along the thermal joint production, the TIM alloys are placed over a substrate and solidify under high cooling rates and transient heat flow conditions. Besides a good thermal contact between the alloy and the substrates, adequate mechanical and corrosion resistances are required in order to preserve the long-term integrity bond of the components. In this sense, in addition to the wetting tests of the alloys over different substrates used by the electronics industry, mechanical (tensile and hardness) and corrosion tests will be carried out. Furthermore, the application of a theoretical-experimental approach in order to determine the heat transfer coefficient at the alloy/substrate interface zone, with a view to permiting its correlation with the alloy wettability, and the characterization of intermetallics formed due to the metallurgical interaction at the TIM/substrate interface are also envisaged. (AU)

Scientific publications

(26)

(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)

DIAS, MARCELINO; VERISSIMO, NATHALIA C.; REGONE, NATAL N.; FREITAS, EMMANUELLE S.; CHEUNG, NOE; GARCIA, AMAURI. Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, JUL 2020. (18/11791-2, 17/15158-0)

OLIVEIRA, RICARDO; CRUZ, CLARISSA; BARROS, ANDRE; BERTELLI, FELIPE; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; CHEUNG, NOE. Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, JUN 2021. (17/15158-0)

DA CRUZ, CLARISSA B.; LIMA, THIAGO S.; COSTA, THIAGO A.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE. Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness. MATERIALS RESEARCH EXPRESS, v. 6, n. 12, DEC 2019. (17/15158-0)

CURTULO, JOANISA P.; DIAS, MARCELINO; BERTELLI, FELIPE; SILVA, BISMARCK L.; SPINELLI, JOSE E.; GARCIA, AMAURI; CHEUNG, NOE. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates. JOURNAL OF MANUFACTURING PROCESSES, v. 48, p. 164-173, DEC 2019. (17/15158-0, 18/11791-2)

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; SILVA, BISMARCK; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Microstructural and segregation effects affecting the corrosion behavior of a high-temperature Bi-Ag solder alloy in dilute chloride solution. Journal of Applied Electrochemistry, v. 51, n. 5, p. 769-780, MAY 2021. (17/12741-6, 19/23673-7, 17/15158-0)

XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7, JUL 2018. (17/15158-0, 15/11863-5, 16/10596-6, 16/18186-1)

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, FEB 2021. (19/23673-7, 17/15158-0)

DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, FEB 2018. (13/09267-0, 17/15158-0, 16/18186-1)

DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, 2018. (17/15158-0, 16/18186-1, 17/12741-6, 15/11863-5)

DIAS, MARCELINO; COSTA, THIAGO A.; SILVA, BISMARCK L.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. MICROELECTRONICS RELIABILITY, v. 81, p. 150-158, FEB 2018. (17/15158-0, 13/09267-0, 16/18186-1)

SEPTIMIO, RUDIMYLLA S.; COSTA, THIAGO A.; VIDA, TALITA A.; GARCIA, AMAURI; CHEUNG, NOE. Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys. MICROELECTRONICS RELIABILITY, v. 78, p. 100-110, NOV 2017. (17/15158-0)

DIAS, MARCELINO; VERISSIMO, NATHALIA C.; REGONE, NATAL N.; FREITAS, EMMANUELLE S.; CHEUNG, NOE; GARCIA, AMAURI. Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, v. 56, n. 1, p. 11-21, JAN 2 2021. (18/11791-2, 17/15158-0)

SEPTIMIO, RUDIMYLLA S.; ARENAS, MARIA A.; CONDE, ANA; GARCIA, AMAURI; CHEUNG, NOE; DE DAMBORENEA, JUAN. Galvanic corrosion analysis of a Bi-Zn solder alloy coupled to Ni and Cu substrates. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, v. 55, n. 8, p. 10-pg., 2020-07-07. (17/15158-0, 17/16058-9)

SEPTIMIO, RUDIMYLLA S.; ARENAS, MARIA A.; CONDE, ANA; GARCIA, AMAURI; CHEUNG, NOE; DE DAMBORENEA, JUAN. Galvanic corrosion analysis of a Bi-Zn solder alloy coupled to Ni and Cu substrates. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, JUL 2020. (17/16058-9, 17/15158-0)

KAKITANI, RAFAEL; PINTO DA SILVA, CASSIO AUGUSTO; SILVA, BISMARCK; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys. SOLDERING & SURFACE MOUNT TECHNOLOGY, JUN 2021. (17/12741-6, 19/23673-7, 17/15158-0)

SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, JAN 18 2018. (17/15158-0, 16/10596-6, 17/12741-6)

SEPTIMIO, RUDIMYLLA S.; ARENAS, MARIA A.; CONDE, ANA; GARCIA, AMAURI; CHEUNG, NOE; DE DAMBORENEA, JUAN. Correlation between microstructure and corrosion behaviour of Bi-Zn solder alloys. CORROSION ENGINEERING SCIENCE AND TECHNOLOGY, v. 54, n. 4, p. 362-368, MAY 19 2019. (17/16058-9, 17/15158-0)

CRUZ, CLARISSA; LIMA, THIAGO; SOARES, MARCO; FREITAS, EMMANUELLE; FUJIWARA, ERIC; GARCIA, AMAURI; CHEUNG, NOE. Effect of Microstructure Features on the Corrosion Behavior of the Sn-2.1 wt%Mg Solder Alloy. ELECTRONIC MATERIALS LETTERS, v. 16, n. 3, JAN 2020. (17/15158-0)

ROCHA, O. L.; COSTA, T. A.; DIAS, M.; GARCIA, A.. Cellular/dendritic transition, dendritic growth and microhardness in directionally solidified monophasic Sn-2%Sb alloy. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, v. 28, n. 8, p. 1679-1686, AUG 2018. (16/18186-1, 17/15158-0)

KAKITANI, RAFAEL; PINTO DA SILVA, CASSIO AUGUSTO; SILVA, BISMARCK; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys. SOLDERING & SURFACE MOUNT TECHNOLOGY, v. 34, n. 1, p. 24-30, JAN 3 2022. (19/23673-7, 17/12741-6, 17/15158-0)

LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, SEP 2019. (17/15158-0, 16/10596-6, 15/11863-5, 17/12741-6)

SOARES, THIAGO; CRUZ, CLARISSA; XAVIER, MARCELLA; REYES, V, RODRIGO; BERTELLI, FELIPE; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates. Journal of Alloys and Compounds, v. 860, APR 15 2021. (19/23673-7, 17/15158-0)

KAKITANI, RAFAEL; CRUZ, CLARISSA B.; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE. Transient directional solidification of a eutectic Al-Si-Ni alloy: Macrostructure, microstructure, dendritic growth and hardness. MATERIALIA, v. 7, SEP 2019. (17/15158-0)

DIAS, MARCELINO; BOGNO, ABDOUL AZIZ; SPINELLI, JOSE EDUARDO; OLIVEIRA, RICARDO; CHEUNG, NOE; GARCIA, AMAURI; HENEIN, HANI. Microstructure and Hardness of an Al-8 wt%Si-2.5 wt%Bi Alloy Subjected to Solidification Cooling Rates from 0.1 to 800 K s(-1). ADVANCED ENGINEERING MATERIALS, v. N/A, p. 11-pg., 2022-11-29. (16/18186-1, 19/23673-7, 18/11791-2, 17/12741-6, 17/15158-0)

CRUZ, CLARISSA; LIMA, THIAGO; KAKITANI, RAFAEL; BARROS, ANDRE; GARCIA, AMAURI; CHEUNG, NOE. Plate-like growth in a eutectic Bi-Ni alloy: effects of morphological microstructure evolution and Bi3Ni intermetallic phase on tensile properties. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 9, n. 3, p. 4940-4950, MAY-JUN 2020. (17/15158-0)

OLIVEIRA, RICARDO; CRUZ, CLARISSA; BARROS, ANDRE; BERTELLI, FELIPE; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; CHEUNG, NOE. Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, v. 147, n. 8, p. 14-pg., 2021-06-20. (17/15158-0)