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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Texto completo
Autor(es):
Curtulo, Joanisa P. [1] ; Dias, Marcelino [1] ; Bertelli, Felipe [2] ; Silva, Bismarck L. [3] ; Spinelli, Jose E. [4] ; Garcia, Amauri [1] ; Cheung, Noe [1]
Número total de Autores: 7
Afiliação do(s) autor(es):
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[2] Univ Santa Cecilia, UNISANTA, Postgrad Program Mech Engn, BR-11045907 Santos, SP - Brazil
[3] Univ Fed Rio Grande do Norte, Dept Mat Engn, UFRN, BR-59078970 Natal, RN - Brazil
[4] Univ Fed Sao Carlos, Dept Mat Engn, UFSCar, BR-13565905 Sao Carlos, SP - Brazil
Número total de Afiliações: 4
Tipo de documento: Artigo Científico
Fonte: JOURNAL OF MANUFACTURING PROCESSES; v. 48, p. 164-173, DEC 2019.
Citações Web of Science: 2
Resumo

Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending very different conditions. A straightforward view of the mechanisms affecting the heat transfer efficiencies was consistent with a number of techniques applied in the present investigation, which includes directional solidification experiments, analytical modelling, wettability analyses and characterization of the reactions between the alloy and the substrates. The proposed analytical model was perceptive to these reactions. For the Cu substrate, the motion of Cu towards the alloy was more effective as compared to the motion of Ni from the Ni substrate. As a consequence, the alloy/Cu interface presented a higher level of Kirkendall voids. The higher fraction of voids at the interface resulted in lower interfacial thermal conductance for the Sn-Sb/Cu couple. Hence, the present experimental-theoretical approach is useful to indicate the solder joint integrity in terms of the presence of empty spots. Despite the higher thermal conductivity of Cu and lower contact angle between the alloy and the Cu in comparison to the Ni substrate, the high porosity at the Cu interface during alloy soldering was shown to reduce the heat transfer capability. (AU)

Processo FAPESP: 18/11791-2 - Evolução Microestrutural e Resistências Mecânica e ao Desgaste de Ligas Ternárias Al-Bi-Si e Al-Bi-Ni Solidificadas Unidirecionalmente
Beneficiário:José Marcelino da Silva Dias Filho
Linha de fomento: Bolsas no Exterior - Estágio de Pesquisa - Pós-Doutorado
Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
Beneficiário:Amauri Garcia
Linha de fomento: Auxílio à Pesquisa - Regular