Effect of Microstructure Features on the Corrosion Behavior of the Sn-2.1 wt%Mg Solder Alloy

Autor(es)

Cruz, Clarissa ^[1] ; Lima, Thiago ^[1] ; Soares, Marco ^[2] ; Freitas, Emmanuelle ^[3] ; Fujiwara, Eric ^[2] ; Garcia, Amauri ^[1] ; Cheung, Noe ^[1]

Afiliação do(s) autor(es)

^[1] Univ Campinas UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil

^[2] Univ Campinas UNICAMP, Lab Photon Mat & Devices, BR-13083860 Campinas, SP - Brazil

^[3] Univ Fed Sao Paulo, UNIFESP, BR-11030400 Santos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: ELECTRONIC MATERIALS LETTERS; v. 16, n. 3 JAN 2020.
• Citações Web of Science: 0

Resumo

The Sn-Mg eutectic alloy is a potential replacement for the traditional Sn-38.1 wt%Pb solder alloy, since lead has been banned because of its risk to human health and the environment. However, studies in the literature related to the Sn-2.1 wt%Mg alloy are restricted to mechanical, electrical and thermal properties. Therefore, this study aims to evaluate the corrosion behavior of this alloy, as a function of the microstructural arrangement obtained from directional solidification performed in a transient heat extraction regime. The thermal solidification parameters (solidification growth rate and cooling rate) were determined along the length of the casting for correlations with microstructural features. The resulting microstructure was characterized by scanning electron microscopy, energy-dispersive X-ray spectroscopy and X-ray diffraction. Subsequently, the electrochemical impedance spectroscopy, linear polarization, equivalent circuit and evolution of hydrogen release analyzes were performed to evaluate the corrosion behavior of the samples in a 0.5 M NaCl solution at 25 degrees C. Interphase spacing and Mg2Sn fraction were found to influence the corrosion behavior, showing higher corrosion resistance for a more refined microstructure. {[}GRAPHICS] . (AU)

• Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
• Beneficiário: Amauri Garcia
• Linha de fomento: Auxílio à Pesquisa - Regular