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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance

Texto completo
Septimio, Rudimylla [1] ; Cruz, Clarissa [2] ; Xavier, Marcella [3] ; Lima, Thiago [2] ; Garcia, Amauri [2] ; Spinelli, Jose Eduardo [4] ; Cheung, Noe [2]
Número total de Autores: 7
Afiliação do(s) autor(es):
[1] Fed Univ South & Southeast Para, UNIFESSPA, Inst Geosci & Engn, BR-68050080 Maraba, PA - Brazil
[2] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[3] Univ Fed Sao Carlos, Grad Program Mat Sci & Engn, BR-13565905 Sao Carlos, SP - Brazil
[4] Univ Fed Sao Carlos, UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Número total de Afiliações: 4
Tipo de documento: Artigo Científico
Citações Web of Science: 0

Industry is searching for ways of improving the process control required for the manufacture of electronic circuitry. In this respect, a numerical mathematical model for thermal contact conductance of solder/substrate couples is developed based on an inverse heat conduction problem. The intention of this research is combining the model results and wetting experiments in order to determine if there is a compromise between them in the matter of the Bi-Zn eutectic alloy. Substrate materials considered as priority for the electronics industry were tested. It was found that the heat transfer coefficients (h) and the contact angles (theta) might be related to each other. The Bi-Zn/copper, Bi-Zn/nickel, Bi-Zn/Invar and Bi-Zn/steel couples, in this order, generated theta varying from the smallest to the largest as well as h from the largest to the smallest. Microstructural coarsening effect has been realized with higher spacing between Zn fibers (lambda(Zn)) referring to a condition of worse heat extraction imposed by an alloy/substrate couple during solidification. (AU)

Processo FAPESP: 19/23673-7 - Avaliação de ligas para juntas térmicas e para manufatura aditiva
Beneficiário:José Eduardo Spinelli
Linha de fomento: Auxílio à Pesquisa - Regular
Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
Beneficiário:Amauri Garcia
Linha de fomento: Auxílio à Pesquisa - Regular