| Texto completo | |
| Autor(es): |
Kakitani, Rafael
[1]
;
Pinto da Silva, Cassio Augusto
[1]
;
Silva, Bismarck
[2]
;
Garcia, Amauri
[3]
;
Cheung, Noe
[3]
;
Spinelli, Jose Eduardo
[4]
Número total de Autores: 6
|
| Afiliação do(s) autor(es): | [1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, Campinas - Brazil
[2] Univ Fed Rio Grande do Norte, UFRN, Dept Mat Engn, Natal, RN - Brazil
[3] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, Sao Carlos, SP - Brazil
[4] Univ Fed Sao Carlos, UFSCar, Dept Mat Engn, Sao Carlos - Brazil
Número total de Afiliações: 4
|
| Tipo de documento: | Artigo Científico |
| Fonte: | SOLDERING & SURFACE MOUNT TECHNOLOGY; v. 34, n. 1, p. 24-30, JAN 3 2022. |
| Citações Web of Science: | 0 |
| Resumo | |
Purpose - Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients within the experimental spectrum. In these cases, associations only with the solidification velocity could give the false impression that reaching a given velocity would be enough to reproduce a result. However, that velocity must necessarily be accompanied by a specific thermal gradient during transient solidification. Therefore, the purpose of this paper is to not only project velocity but also include the gradients acting for each velocity. Design/methodology/approach - Compilation of solidification velocity, v, thermal gradient, G, and cooling rate, T., data for Sn-Cu and Sn-Bi solder alloys of interest is presented. These data are placed in the form of coupled growth zones according to the correlated microstructures in the literature. In addition, results generated in this work for Sn-(0.5, 0.7, 2.0, 2.8)% Cu and Sn-(34, 52, 58)% Bi alloys solidified under non-stationary conditions are added. Findings - When analyzing the cooling rate (T. = G.v) and velocity separately, in or around the eutectic composition, a consensus cannot be reached on the resulting microstructure. The (v vs. G) 1 cooling rate diagrams allow comprehensive analyzes of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. Originality/value - The present paper is devoted to the establishment of (v vs. G) 1 cooling rate diagrams. These plots may allow comprehensive analyses of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. This microstructure-processing mapping approach is promising to predict phase competition and resulting microstructures in soldering of Sn-Cu and Sn-Bi alloys. These two classes of alloys are of interest to the soldering industry, whereas manipulation of their microstructures is considered of utmost importance for the metallurgical quality of the product. (AU) | |
| Processo FAPESP: | 19/23673-7 - Avaliação de ligas para juntas térmicas e para manufatura aditiva |
| Beneficiário: | José Eduardo Spinelli |
| Modalidade de apoio: | Auxílio à Pesquisa - Regular |
| Processo FAPESP: | 17/12741-6 - Aplicação de técnicas experimentais de solidificação, caracterização microestrutural e de propriedades na avaliação de ligas eutéticas e hipereutéticas à base de Al e Zn |
| Beneficiário: | José Eduardo Spinelli |
| Modalidade de apoio: | Auxílio à Pesquisa - Regular |
| Processo FAPESP: | 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial |
| Beneficiário: | Amauri Garcia |
| Modalidade de apoio: | Auxílio à Pesquisa - Regular |