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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

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Author(s):
Kakitani, Rafael [1] ; Pinto da Silva, Cassio Augusto [1] ; Silva, Bismarck [2] ; Garcia, Amauri [3] ; Cheung, Noe [3] ; Spinelli, Jose Eduardo [4]
Total Authors: 6
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, Campinas - Brazil
[2] Univ Fed Rio Grande do Norte, UFRN, Dept Mat Engn, Natal, RN - Brazil
[3] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, Sao Carlos, SP - Brazil
[4] Univ Fed Sao Carlos, UFSCar, Dept Mat Engn, Sao Carlos - Brazil
Total Affiliations: 4
Document type: Journal article
Source: SOLDERING & SURFACE MOUNT TECHNOLOGY; v. 34, n. 1, p. 24-30, JAN 3 2022.
Web of Science Citations: 0
Abstract

Purpose - Overall, selection maps about the extent of the eutectic growth projects the solidification velocities leading to given microstructures. This is because of limitations of most of the set of results when obtained for single thermal gradients within the experimental spectrum. In these cases, associations only with the solidification velocity could give the false impression that reaching a given velocity would be enough to reproduce a result. However, that velocity must necessarily be accompanied by a specific thermal gradient during transient solidification. Therefore, the purpose of this paper is to not only project velocity but also include the gradients acting for each velocity. Design/methodology/approach - Compilation of solidification velocity, v, thermal gradient, G, and cooling rate, T., data for Sn-Cu and Sn-Bi solder alloys of interest is presented. These data are placed in the form of coupled growth zones according to the correlated microstructures in the literature. In addition, results generated in this work for Sn-(0.5, 0.7, 2.0, 2.8)% Cu and Sn-(34, 52, 58)% Bi alloys solidified under non-stationary conditions are added. Findings - When analyzing the cooling rate (T. = G.v) and velocity separately, in or around the eutectic composition, a consensus cannot be reached on the resulting microstructure. The (v vs. G) 1 cooling rate diagrams allow comprehensive analyzes of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. Originality/value - The present paper is devoted to the establishment of (v vs. G) 1 cooling rate diagrams. These plots may allow comprehensive analyses of the combined v and G effects on the subsequent microstructure of the Sn-Cu and Sn-Bi alloys. This microstructure-processing mapping approach is promising to predict phase competition and resulting microstructures in soldering of Sn-Cu and Sn-Bi alloys. These two classes of alloys are of interest to the soldering industry, whereas manipulation of their microstructures is considered of utmost importance for the metallurgical quality of the product. (AU)

FAPESP's process: 19/23673-7 - Evaluation of alloys for thermal interface contact and for additive manufacturing
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 17/12741-6 - Application of experimental solidification techniques, characterization of microstructure and properties in the evaluation of eutectic and hypereutectic Al-base and Zn-base alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 17/15158-0 - Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants