Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching

Autor(es)

Chiappim, William ; Neto, Benedito Botan ; Shiotani, Michaela ; Karnopp, Julia ; Goncalves, Luan ; Chaves, Joao Pedro ; Sobrinho, Argemiro da Silva ; Leitao, Joaquim Pratas ; Fraga, Mariana ; Pessoa, Rodrigo

• Tipo de documento: Artigo Científico
• Fonte: NANOMATERIALS; v. 12, n. 19, p. 32-pg., 2022-10-01.

Resumo

The growing need for increasingly miniaturized devices has placed high importance and demands on nanofabrication technologies with high-quality, low temperatures, and low-cost techniques. In the past few years, the development and recent advances in atomic layer deposition (ALD) processes boosted interest in their use in advanced electronic and nano/microelectromechanical systems (NEMS/MEMS) device manufacturing. In this context, non-thermal plasma (NTP) technology has been highlighted because it allowed the ALD technique to expand its process window and the fabrication of several nanomaterials at reduced temperatures, allowing thermosensitive substrates to be covered with good formability and uniformity. In this review article, we comprehensively describe how the NTP changed the ALD universe and expanded it in device fabrication for different applications. We also present an overview of the efforts and developed strategies to gather the NTP and ALD technologies with the consecutive formation of plasma-assisted ALD (PA-ALD) technique, which has been successfully applied in nanofabrication and surface modification. The advantages and limitations currently faced by this technique are presented and discussed. We conclude this review by showing the atomic layer etching (ALE) technique, another development of NTP and ALD junction that has gained more and more attention by allowing significant advancements in plasma-assisted nanofabrication. (AU)

• Processo FAPESP: 21/03620-6 - Aplicação e caracterização de jato de plasma tipo gliding arc na ativação de líquidos visando aplicações relacionadas à Odontologia
• Beneficiário: Benedito Donizeti Botan Neto
• Modalidade de apoio: Bolsas no Brasil - Iniciação Científica
• Processo FAPESP: 20/10450-7 - Explorando o potencial do líquido ativado com plasma (PAL): caracterização do plasma e aplicação do PAL no tratamento endodôntico
• Beneficiário: William Chiappim Junior
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado
• Processo FAPESP: 18/01265-1 - Síntese e análise microbiológica de substratos poliméricos recobertos com filmes ultra-finos de TiO2 e/ou Al2O3 pela tecnologia de deposição por camada atômica
• Beneficiário: Rodrigo Savio Pessoa
• Modalidade de apoio: Auxílio à Pesquisa - Regular