Cellular growth of single-phase Zn-Ag alloys unidirectionally solidified

Autor(es)

Dias, Marcelino ^[1] ; Brito, Crystopher ^[1] ; Bertelli, Felipe ^[1] ; Garcia, Amauri ^[1]

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, Dept Mat Engn, BR-13083970 Campinas, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Materials Chemistry and Physics; v. 143, n. 3, p. 895-899, FEB 14 2014.
• Citações Web of Science: 9

Resumo

Transient unidirectional solidification experiments have been carried out with a single-phase Zn-Ag alloy under cooling rates in the range of 0.1-40 K s(-1). The resulting macrostructure is shown to be typified by columnar grains aligned along the heat flow direction and the microstructure is characterized by a cellular morphology along the entire casting length with no evidence of cellular/dendritic transition. A regular to plate-like cells transition is shown to occur for cooling rates higher than 10K s(-1). Experimental results from the literature on the cellular growth of single-phase Zn-Ag alloys in steady-state solidification conditions are compared with the results of the present investigation. An experimental growth law relating the cell spacing with the cooling rate is proposed, which is shown to be able to represent both the steady-state and transient growth regimes of single-phase Zn-Ag alloys. The Bouchard-Kirkaldy model is shown to be the only theoretical growth model that matches the cellular experimental scatters in both solidification regimes. (C) 2013 Elsevier B.V. All rights reserved. (AU)

• Processo FAPESP: 12/08494-0 - Parâmetros Térmicos e Microestruturais na Solidificação Transitória de Ligas Al-Mg e Al-Mg-Si e Correlação com Resistências Mecânica e à Corrosão
• Beneficiário: Crystopher Cardoso de Brito
• Modalidade de apoio: Bolsas no Brasil - Doutorado
• Processo FAPESP: 13/09267-0 - Evolução microestrutural na solidificação transitória de ligas monofásicas e peritéticas Sn-Sb (e Sn-Sb-X) para soldagem e em camadas interfaciais solda/substrato
• Beneficiário: José Marcelino da Silva Dias Filho
• Modalidade de apoio: Bolsas no Brasil - Doutorado
• Processo FAPESP: 12/16328-2 - Correlação entre Microestruturas de Solidificação e Propriedades Mecânicas e Tribológicas de Ligas Al-Sn-Cu e Al-Sn-Si
• Beneficiário: Felipe Bertelli
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado