| Full text | |
| Author(s): |
Total Authors: 4
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| Affiliation: | [1] Univ Estadual Campinas, Dept Mat Engn, BR-13083970 Campinas, SP - Brazil
Total Affiliations: 1
|
| Document type: | Journal article |
| Source: | Materials Chemistry and Physics; v. 143, n. 3, p. 895-899, FEB 14 2014. |
| Web of Science Citations: | 9 |
| Abstract | |
Transient unidirectional solidification experiments have been carried out with a single-phase Zn-Ag alloy under cooling rates in the range of 0.1-40 K s(-1). The resulting macrostructure is shown to be typified by columnar grains aligned along the heat flow direction and the microstructure is characterized by a cellular morphology along the entire casting length with no evidence of cellular/dendritic transition. A regular to plate-like cells transition is shown to occur for cooling rates higher than 10K s(-1). Experimental results from the literature on the cellular growth of single-phase Zn-Ag alloys in steady-state solidification conditions are compared with the results of the present investigation. An experimental growth law relating the cell spacing with the cooling rate is proposed, which is shown to be able to represent both the steady-state and transient growth regimes of single-phase Zn-Ag alloys. The Bouchard-Kirkaldy model is shown to be the only theoretical growth model that matches the cellular experimental scatters in both solidification regimes. (C) 2013 Elsevier B.V. All rights reserved. (AU) | |
| FAPESP's process: | 12/08494-0 - Thermal and Microstructural Parameters in the Transient Solidification of Al-Mg and Al-Mg-Si Alloys and Correlation with Mechanical and Corrosion Resistances |
| Grantee: | Crystopher Cardoso de Brito |
| Support Opportunities: | Scholarships in Brazil - Doctorate |
| FAPESP's process: | 13/09267-0 - Microstructural evolution in the transient solidification of monophasic and peritectic Sn-Sb solder alloys (and Sn-Sb-X) and in solder/substrate interfacial layers |
| Grantee: | José Marcelino da Silva Dias Filho |
| Support Opportunities: | Scholarships in Brazil - Doctorate |
| FAPESP's process: | 12/16328-2 - The Correlation between Solidification Microstructures and Mechanical and Tribological Properties of Al-Sn-Cu and Al-Sn-Si Alloys |
| Grantee: | Felipe Bertelli |
| Support Opportunities: | Scholarships in Brazil - Post-Doctoral |