Scholarship 16/18186-1 - Propriedades mecânicas - BV FAPESP
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Microstructural evolution and mechanical and wear resistances of ternary Al-Bi-Si and Al-Bi-Ni alloys unidirectionally solidified

Grant number: 16/18186-1
Support Opportunities:Scholarships in Brazil - Post-Doctoral
Start date until: December 01, 2016
End date until: January 31, 2021
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Transformation Metallurgy
Agreement: Coordination of Improvement of Higher Education Personnel (CAPES)
Principal Investigator:Amauri Garcia
Grantee:José Marcelino da Silva Dias Filho
Host Institution: Faculdade de Engenharia Mecânica (FEM). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
Associated scholarship(s):18/11791-2 - Microstructural Evolution and Mechanical and Wear Resistances of Ternary Al-Bi-Si and Al-Bi-Ni alloys Unidirectionally Solidified, BE.EP.PD

Abstract

The microstructural characterization along the solidification process of metallic alloys is fundamental, since once understood the correlation between steps of the manufacturing process and characteristics of the final component, the attainment of appropriate properties can be previously planned. In this sense, functional relations permitting microstructural parameters and mechanical and wear resistances to be correlated, would be fundamental for the pre-programming of final properties. Binary Al-Bi alloys have been studied in the literature with focus on tribological applications, i.e. specifically for bearing and internal parts of combustion engines. However, the design of new engines, which will be subjected to higher loads and velocities, will demand better properties to support the operation at higher temperatures, and Al-Bi binary alloys will need to be replaced with new alternative Al-Bi-X alloys. The objective of the present study is to contribute to the understanding of modifications caused by a third alloying addition, in particular Si and Ni, on the microstructural evolution and the corresponding mechanical and tribological properties. The role of Si and Ni on the strengthening of the Al-rich matrix, and of Bi as a solid lubricant are well-known characteristics. However, the literature is scarce on detailed studies relating microstructure evolution, phases characterization and application properties of alloys of the ternary systems Al-Bi-Si e Al-Bi-Ni. In the present work a wide experimental study is envisaged, focusing on the microstructural evolution of such alloys, identifying phases, morphologies and characteristics length scales along solidification. These alloys will be solidified under transient heat flow conditions for a wide range of cooling rates during unidirectional solidification. Solidification thermal parameters such as the growth rate (V), the thermal gradient (G), and the cooling rate (T ) will be experimentally determined. Experimental growth laws relating microstructural and thermal parameters and functional relations between mechanical and wear resistances as a function of representative microstructural length scales will be developed. To complement the comprehension on the microstructure evolution of these alloys, Bridgman growth of samples of some alloys compositions will be filmed in situ using X-ray techniques, in the Institut Matériaux Microélectronique Nanosciences de Provence (IM2NP) - Aix Marseille Université (AMU), France, through a research internship (BEPE-FAPESP). (AU)

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Scientific publications (9)
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, . (13/09267-0, 17/15158-0, 16/18186-1)
DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, . (17/15158-0, 16/18186-1, 17/12741-6, 15/11863-5)
DIAS, MARCELINO; COSTA, THIAGO A.; SILVA, BISMARCK L.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. MICROELECTRONICS RELIABILITY, v. 81, p. 150-158, . (17/15158-0, 13/09267-0, 16/18186-1)
XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7, . (17/15158-0, 15/11863-5, 16/10596-6, 16/18186-1)
LIMA, THIAGO SOARES; DE GOUVEIA, GUILHERME LISBOA; SEPTIMIO, RUDIMYLLA DA SILVA; DA CRUZ, CLARISSA BARROS; SILVA, BISMARCK LUIZ; BRITO, CRYSTOPHER; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. METALS, v. 9, n. 2, . (17/12741-6, 15/11863-5, 16/18186-1)
OLIVEIRA, RICARDO; COSTA, THIAGO A.; DIAS, MARCELINO; KONNO, CAMILA; CHEUNG, NOE; GARCIA, AMAURI. Transition from high cooling rate cells to dendrites in directionally solidified Al-Sn-(Pb) alloys. MATERIALS TODAY COMMUNICATIONS, v. 25, . (16/18186-1)
ROCHA, O. L.; COSTA, T. A.; DIAS, M.; GARCIA, A.. Cellular/dendritic transition, dendritic growth and microhardness in directionally solidified monophasic Sn-2%Sb alloy. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, v. 28, n. 8, p. 1679-1686, . (16/18186-1, 17/15158-0)
BISMARCK LUIZ SILVA; JOSÉ EDUARDO SPINELLI. Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 2, . (15/11863-5, 17/12741-6, 16/18186-1)
DIAS, MARCELINO; BOGNO, ABDOUL AZIZ; SPINELLI, JOSE EDUARDO; OLIVEIRA, RICARDO; CHEUNG, NOE; GARCIA, AMAURI; HENEIN, HANI. Microstructure and Hardness of an Al-8 wt%Si-2.5 wt%Bi Alloy Subjected to Solidification Cooling Rates from 0.1 to 800 K s(-1). ADVANCED ENGINEERING MATERIALS, v. N/A, p. 11-pg., . (16/18186-1, 19/23673-7, 18/11791-2, 17/12741-6, 17/15158-0)

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