Growth direction and Si alloying affecting directionally solidified structures of Al-Cu-Si alloys

Autor(es)

Costa, T. A. ^[1] ; Moreira, A. L. ^[2] ; Moutinho, D. J. ^[3] ; Dias, M. ^[1] ; Ferreira, I. L. ^[4] ; Spinelli, J. E. ^[5] ; Rocha, O. L. ^[3] ; Garcia, A. ^[1]

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, UNICAMP, Dept Mat & Mfg Engn, BR-13083970 Campinas, SP - Brazil

^[2] Fed Univ Para, UFPA, Fac Mech Engn, BR-66075110 Belem, Para - Brazil

^[3] IFPA, Fed Inst Educ Sci & Technol Para, BR-66093020 Belem, Para - Brazil

^[4] Univ Fed Fluminense, Dept Mech Engn, BR-27255125 Volta Redonda, RJ - Brazil

^[5] Univ Fed Sao Carlos, UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: MATERIALS SCIENCE AND TECHNOLOGY; v. 31, n. 9, p. 1103-1112, MAY 2015.
• Citações Web of Science: 23

Resumo

The roles of growth direction and Si content on the columnar/equiaxed transition and on dendritic spacings of Al-Cu-Si alloys still remain as an open field to be studied. In the present investigation, Al-6 wt-%Cu-4 wt-%Si and Al-6 wt-%Cu alloys were directionally solidified upwards and horizontally under transient heat flow conditions. The experimental results include tip growth rate and cooling rates, optical microscopy, scanning electron microscopy energy dispersive spectrometry and dendrite arm spacings. It was found that silicon alloying contributes to significant refinement of primary/secondary dendritic spacings for the upward configuration as compared with corresponding results of the horizontal growth. Experimental growth laws are proposed, and the effects of the presence/absence of solutal convection in both growth directions are discussed. (AU)

• Processo FAPESP: 13/23396-7 - Efeitos de parâmetros da microestrutura de solidificação de ligas multicomponentes à base de alumínio (Al-Mg-Si; Al-Sn-Cu; Al-Zn-Mg) nas resistências à degradação por corrosão e tribocorrosão
• Beneficiário: Amauri Garcia
• Linha de fomento: Auxílio à Pesquisa - Regular
• Processo FAPESP: 13/09267-0 - Evolução microestrutural na solidificação transitória de ligas monofásicas e peritéticas Sn-Sb (e Sn-Sb-X) para soldagem e em camadas interfaciais solda/substrato
• Beneficiário: José Marcelino da Silva Dias Filho
• Linha de fomento: Bolsas no Brasil - Doutorado