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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Growth direction and Si alloying affecting directionally solidified structures of Al-Cu-Si alloys

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Author(s):
Costa, T. A. [1] ; Moreira, A. L. [2] ; Moutinho, D. J. [3] ; Dias, M. [1] ; Ferreira, I. L. [4] ; Spinelli, J. E. [5] ; Rocha, O. L. [3] ; Garcia, A. [1]
Total Authors: 8
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Dept Mat & Mfg Engn, BR-13083970 Campinas, SP - Brazil
[2] Fed Univ Para, UFPA, Fac Mech Engn, BR-66075110 Belem, Para - Brazil
[3] IFPA, Fed Inst Educ Sci & Technol Para, BR-66093020 Belem, Para - Brazil
[4] Univ Fed Fluminense, Dept Mech Engn, BR-27255125 Volta Redonda, RJ - Brazil
[5] Univ Fed Sao Carlos, UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 5
Document type: Journal article
Source: MATERIALS SCIENCE AND TECHNOLOGY; v. 31, n. 9, p. 1103-1112, MAY 2015.
Web of Science Citations: 23
Abstract

The roles of growth direction and Si content on the columnar/equiaxed transition and on dendritic spacings of Al-Cu-Si alloys still remain as an open field to be studied. In the present investigation, Al-6 wt-%Cu-4 wt-%Si and Al-6 wt-%Cu alloys were directionally solidified upwards and horizontally under transient heat flow conditions. The experimental results include tip growth rate and cooling rates, optical microscopy, scanning electron microscopy energy dispersive spectrometry and dendrite arm spacings. It was found that silicon alloying contributes to significant refinement of primary/secondary dendritic spacings for the upward configuration as compared with corresponding results of the horizontal growth. Experimental growth laws are proposed, and the effects of the presence/absence of solutal convection in both growth directions are discussed. (AU)

FAPESP's process: 13/23396-7 - Effects of solidification MicrostructureParameters of Aluminum-based multicomponent alloys (Al-Mg-Si; Al-Sn-Cu; Al-Zn-Mg) on the resistances to Corrosionand tribocorrosion degradation
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants
FAPESP's process: 13/09267-0 - Microstructural evolution in the transient solidification of monophasic and peritectic Sn-Sb solder alloys (and Sn-Sb-X) and in solder/substrate interfacial layers
Grantee:José Marcelino da Silva Dias Filho
Support Opportunities: Scholarships in Brazil - Doctorate